Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 13/20 | 0.44 |
| ▸ | ESR2 | Q92731 | 9/20 | 0.44 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.43 |
| ▸ | FGFR2 | P21802 | 1/20 | 0.43 |
| ▸ | AR | P10275 | 2/20 | 0.41 |
| ▸ | USP7 | Q93009 | 1/20 | 0.36 |
| ▸ | HSD17B1 | P14061 | 1/20 | 0.36 |
| ▸ | HSD17B2 | P37059 | 1/20 | 0.36 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1131458 | 0.82 | ALPL (0.38) | AMY1A | |
| SCHEMBL14243388 | 0.79 | AMY1A (0.35) | AMY1A | |
| SCHEMBL1629842 | 0.79 | ALOX5AP (0.36) | — | |
| SCHEMBL18688871 | 0.79 | ALPL (0.32) | — | |
| SCHEMBL1482825 | 0.78 | ADH5 (0.41) | — | |
| SCHEMBL25160138 | 0.77 | AMY1A (0.42) | ARAMY1A | |
| SCHEMBL1577476 | 0.76 | PARP1 (0.40) | AR | |
| SCHEMBL3314573 | 0.76 | AMY1A (0.32) | ESR1ESR2AMY1A | |
| SCHEMBL14709912 | 0.76 | ALDH1A1 (0.33) | AMY1A | |
| SCHEMBL18687032 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117904633-A | Copper-free aluminum etching solution | 江苏艾森半导体材料股份有限公司 | 2024-04-19 | — | — | CN | claimed |
| CN-117590708-A | Dry film removing liquid and preparation method and application thereof | 江苏艾森半导体材料股份有限公司 | 2024-02-23 | — | — | CN | claimed |
| CN-116661263-A | Low-aluminum corrosion developer and preparation method and application thereof | 艾森半导体材料(南通)有限公司 | 2023-08-29 | — | — | CN | claimed |
| CN-112663064-A | Copper-molybdenum metal etching solution and preparation method and application thereof | 江苏艾森半导体材料股份有限公司 | 2021-04-16 | — | — | CN | claimed |
| CN-117904633-A | Copper-free aluminum etching solution | 江苏艾森半导体材料股份有限公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-117590708-A | Dry film removing liquid and preparation method and application thereof | 江苏艾森半导体材料股份有限公司 | 2024-02-23 | — | — | CN | disclosed |
| CN-116661263-A | Low-aluminum corrosion developer and preparation method and application thereof | 艾森半导体材料(南通)有限公司 | 2023-08-29 | — | — | CN | disclosed |
| CN-112663064-A | Copper-molybdenum metal etching solution and preparation method and application thereof | 江苏艾森半导体材料股份有限公司 | 2021-04-16 | — | — | CN | disclosed |