SCHEMBL28544293

SCHEMBL28544293

Oc1cccc(F)c1-n1cnnn1

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.44
NOTUM Q6P988 3/20 0.43
ALDH1A1 P00352 4/20 0.40
LMNA P02545 2/20 0.39
KMT2A Q03164 2/20 0.37
KDM4E B2RXH2 1/20 0.37
GAA P10253 1/20 0.37
TP53 P04637 1/20 0.37
F2 P00734 1/20 0.37
KCNJ1 P48048 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.36
NPC1 O15118 1/20 0.35
RAB9A P51151 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29493057 0.73 GPR35 (0.47) MAPTNOTUMALDH1A1LMNAKMT2A
SCHEMBL28722084 0.73 GPR35 (0.47) MAPTNOTUMALDH1A1LMNAKMT2A
SCHEMBL5809497 0.71 ALDH1A1 (0.54) MAPTNOTUMALDH1A1KMT2AKDM4E
SCHEMBL14242848 0.71 ALDH1A1 (0.58) MAPTNOTUMALDH1A1KMT2AKDM4E
SCHEMBL1059987 0.69 MAPT (0.58) MAPTNOTUMALDH1A1LMNATP53
SCHEMBL5795771 0.67 NOTUM (0.44) MAPTNOTUMALDH1A1LMNAKMT2A
SCHEMBL12180513 0.66 LMNA (0.36) MAPTALDH1A1LMNAKDM4ESMN1; SMN2
SCHEMBL1187038 0.66 MAPT (0.53) MAPTNOTUMALDH1A1KMT2AKDM4E
SCHEMBL28643711 0.64 ALDH1A1 (0.53) NOTUMALDH1A1LMNAKMT2AKDM4E
SCHEMBL3389730 0.64 NOTUM (0.63) MAPTNOTUMLMNAKMT2ATP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117904633-A Copper-free aluminum etching solution 江苏艾森半导体材料股份有限公司 2024-04-19 CN claimed
CN-117590708-A Dry film removing liquid and preparation method and application thereof 江苏艾森半导体材料股份有限公司 2024-02-23 CN claimed
CN-116661263-A Low-aluminum corrosion developer and preparation method and application thereof 艾森半导体材料(南通)有限公司 2023-08-29 CN claimed
CN-112663064-A Copper-molybdenum metal etching solution and preparation method and application thereof 江苏艾森半导体材料股份有限公司 2021-04-16 CN claimed
CN-117904633-A Copper-free aluminum etching solution 江苏艾森半导体材料股份有限公司 2024-04-19 CN disclosed
CN-117590708-A Dry film removing liquid and preparation method and application thereof 江苏艾森半导体材料股份有限公司 2024-02-23 CN disclosed
CN-116661263-A Low-aluminum corrosion developer and preparation method and application thereof 艾森半导体材料(南通)有限公司 2023-08-29 CN disclosed