SCHEMBL28547324

SCHEMBL28547324

CCOC([SiH3])C(OCC)(OCC)OC1CCCCC1

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4119769 0.74 THRB (0.38)
SCHEMBL6911600 0.74
SCHEMBL27489356 0.68 EPHX1 (0.36) EPHX1
SCHEMBL7063445 0.67
SCHEMBL10901053 0.66 EPHX1 (0.33) EPHX1
SCHEMBL28727328 0.66 ALDH1A1 (0.46)
SCHEMBL28594788 0.66
SCHEMBL11889223 0.65
SCHEMBL23092241 0.63 SHBG (0.44) EPHX1
SCHEMBL11884148 0.62 LMNA (0.46) EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114207520-A Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, interlayer insulating film, and electronic component 东丽株式会社 2022-03-18 CN disclosed
CN-112368641-A Photosensitive resin composition, photosensitive sheet, cured film of photosensitive resin composition and photosensitive sheet, method for producing cured film, and electronic component 东丽株式会社 2021-02-12 CN disclosed