Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NAAA | Q02083 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | PRKCA | P17252 | 1/20 | 0.33 |
| ▸ | DGKA | P23743 | 1/20 | 0.31 |
| ▸ | RAD52 | P43351 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
| ▸ | FAAH | O00519 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL607473 | 0.94 | NAAA (0.39) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL28042741 | 0.90 | ACHE (0.39) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL98110 | 0.90 | NAAA (0.43) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL12866488 | 0.88 | NAAA (0.35) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL1756096 | 0.88 | NAAA (0.47) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL97896 | 0.88 | NAAA (0.47) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL96745 | 0.88 | NAAA (0.47) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL98429 | 0.88 | NAAA (0.47) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL100193 | 0.85 | DGKA (0.37) | NAAANPSR1MAPTMAPK1L3MBTL1 | |
| SCHEMBL18179724 | 0.84 | NAAA (0.39) | NAAANPSR1MAPTMAPK1L3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-4667545-A1 | PHOTOCURABLE COMPOSITION | Bostik SA (FR) | 2025-12-24 | — | — | EP | disclosed |
| EP-4667546-A1 | PHOTOCURABLE COMPOSITION | Bostik SA (FR) | 2025-12-24 | — | — | EP | disclosed |
| EP-4570791-A1 | THIOESTER PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2025-06-18 | — | — | EP | disclosed |
| EP-4570811-A1 | POLYMERIZABLE PHOSPHINE OXIDE-BASED PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2025-06-18 | — | — | EP | disclosed |
| EP-4570860-A1 | COUMARIN THIOESTER PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2025-06-18 | — | — | EP | disclosed |
| EP-4393720-A1 | PHOSPHINE OXIDE-BASED PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2024-07-03 | — | — | EP | disclosed |
| US-9709952-B2 | Photosensitive composition for volume hologram recording, photosensitive substrate for volume hologram recording, and volume hologram recorded medium | DAI NIPPON PRINTING CO., LTD. (JP) | 2017-07-18 | — | — | US | disclosed |
| EP-2889700-B1 | PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM-RECORDED OBJECT | DAINIPPON PRINTING CO LTD (JP) | 2017-01-25 | — | — | EP | disclosed |
| US-20150212487-A1 | PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM RECORDED MEDIUM | DAI NIPPON PRINTING CO., LTD. | 2015-07-30 | — | — | US | disclosed |
| EP-2889700-A1 | PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM-RECORDED OBJECT | Dai Nippon Printing Co., Ltd. (JP) | 2015-07-01 | — | — | EP | disclosed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |