Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.37 |
| ▸ | TP53 | P04637 | 2/20 | 0.37 |
| ▸ | USP7 | Q93009 | 6/20 | 0.35 |
| ▸ | CNR1 | P21554 | 1/20 | 0.34 |
| ▸ | CNR2 | P34972 | 1/20 | 0.34 |
| ▸ | PRKCZ | Q05513 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.32 |
| ▸ | MEN1 | O00255 | 3/20 | 0.32 |
| ▸ | MAPT | P10636 | 3/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.32 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.32 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11129444 | 0.98 | TDP1 (0.39) | TDP1ALDH1A1CYP3A4TP53USP7 | |
| SCHEMBL5381204 | 0.87 | USP7 (0.37) | TDP1ALDH1A1CYP3A4TP53USP7 | |
| SCHEMBL5382796 | 0.84 | SKP2 (0.40) | TDP1ALDH1A1CYP3A4TP53USP7 | |
| SCHEMBL5386508 | 0.83 | RPS6KA3 (0.38) | TDP1ALDH1A1CYP3A4TP53USP7 | |
| SCHEMBL1143076 | 0.81 | NOS3 (0.35) | ALDH1A1USP7HSD17B10MEN1MAPT | |
| SCHEMBL31193210 | 0.81 | ALDH1A1 (0.39) | TDP1ALDH1A1CYP3A4TP53USP7 | |
| Tetrazole SCHEMBL9632333 | 0.81 | USP7 (0.30) | USP7 | |
| SCHEMBL28106584 | 0.79 | USP7 (0.39) | TDP1ALDH1A1CYP3A4TP53USP7 | |
| SCHEMBL5382005 | 0.79 | ALDH1A1 (0.32) | TDP1ALDH1A1CYP3A4TP53USP7 | |
| SCHEMBL30297625 | 0.79 | ALDH1A1 (0.38) | TDP1ALDH1A1CYP3A4TP53USP7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116553867-B | Solid waste-based environment-friendly brick curing agent | 江西省建材科研设计院有限公司 | 2024-05-14 | — | — | CN | claimed |
| CN-117819870-A | Green industrialized cement self-repairing system prepared based on spray method, and preparation method and application thereof | 天津大学 | 2024-04-05 | — | — | CN | claimed |
| CN-117736680-A | Insulating adhesive composition and preparation method and application thereof | 杭州之江有机硅化工有限公司 | 2024-03-22 | — | — | CN | claimed |
| CN-117603057-A | Preparation method of 3,3 '-diethyl-4, 4' -diaminodiphenyl methane | 江苏湘园化工有限公司 | 2024-02-27 | — | — | CN | claimed |
| CN-116553867-A | Solid waste-based environment-friendly brick curing agent | 江西省建材科研设计院有限公司 | 2023-08-08 | — | — | CN | claimed |
| CN-116332556-B | Self-repairing system for water-adaptive cement, and preparation method and application thereof | 天津大学 | 2023-08-04 | — | — | CN | claimed |
| CN-116332556-A | Self-repairing system for water-adaptive cement, and preparation method and application thereof | 天津大学 | 2023-06-27 | — | — | CN | claimed |
| CN-116103002-A | Anti-cracking high-toughness underfill adhesive and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2023-05-12 | — | — | CN | claimed |
| CN-113897025-B | Benzoxazine resin-based composition for packaging third-generation semiconductor device and preparation method thereof | 江南大学 | 2023-01-24 | — | — | CN | claimed |
| CN-112646556-B | High-sulfur-content gas well oil sleeve annular plugging agent | 中国石油化工股份有限公司 | 2022-09-06 | — | — | CN | claimed |
| CN-114507415-A | Fast-flowing high-temperature-resistant underfill adhesive and preparation method thereof | 郭亚莹 | 2022-05-17 | — | — | CN | claimed |
| CN-113249072-A | Electronic packaging adhesive with good thermal stability and preparation method thereof | 安田信邦（厦门）电子科技有限公司 | 2021-08-13 | — | — | CN | claimed |
| CN-118290739-A | Siloxane modified curing agent, underfill material and preparation method thereof | 中国科学院深圳先进技术研究院 | 2024-07-05 | — | — | CN | disclosed |
| CN-116553867-B | Solid waste-based environment-friendly brick curing agent | 江西省建材科研设计院有限公司 | 2024-05-14 | — | — | CN | disclosed |
| CN-116553867-B | Solid waste-based environment-friendly brick curing agent | 江西省建材科研设计院有限公司 | 2024-05-14 | — | — | CN | disclosed |
| CN-117819870-A | Green industrialized cement self-repairing system prepared based on spray method, and preparation method and application thereof | 天津大学 | 2024-04-05 | — | — | CN | disclosed |
| CN-113897025-B | Benzoxazine resin-based composition for packaging third-generation semiconductor device and preparation method thereof | 江南大学 | 2023-01-24 | — | — | CN | disclosed |
| CN-114507415-A | Fast-flowing high-temperature-resistant underfill adhesive and preparation method thereof | 郭亚莹 | 2022-05-17 | — | — | CN | disclosed |
| CN-113249072-A | Electronic packaging adhesive with good thermal stability and preparation method thereof | 安田信邦（厦门）电子科技有限公司 | 2021-08-13 | — | — | CN | disclosed |
| CN-111212862-A | Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material | 日立化成株式会社 | 2020-05-29 | — | — | CN | disclosed |