SCHEMBL28632561

SCHEMBL28632561

N#Cc1cc(I)c(O)c(I)c1CCCO

nearest known ligand 0.39

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TTR P02766 1/20 0.39
ALB P02768 1/20 0.39
TDP1 Q9NUW8 1/20 0.31
KDM4E B2RXH2 1/20 0.30
MEN1 O00255 1/20 0.30
MAPT P10636 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10763743 0.74 TDP1 (0.40) TTRALBTDP1
SCHEMBL15534992 0.72 KDM4E (0.36) KDM4EMEN1MAPTKMT2A
SCHEMBL6674151 0.71 MAPT (0.34) MAPT
SCHEMBL28305151 0.70 TDP1 (0.39) TTRALBTDP1KDM4E
SCHEMBL10695025 0.70 TTR (0.48) TTRALBKDM4EMEN1MAPT
SCHEMBL22991490 0.67 TDP1 (0.45) TTRALBTDP1KDM4EMAPT
SCHEMBL31467840 0.66 TRPV4 (0.33)
SCHEMBL34464527 0.66 MEN1 (0.32) TTRALBMEN1KMT2A
SCHEMBL28632562 0.64 TTR (0.42) TTRALBTDP1
SCHEMBL22897457 0.63 TDP1 (0.47) TTRALBTDP1KDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110997838-B Silicone-polyether copolymers, sealants including silicone-polyether copolymers, and related methods 美国陶氏有机硅公司 2021-10-01 CN disclosed
CN-110997839-B Silicone-polyether copolymer, method of preparing silicone-polyether copolymer, and sealant including silicone-polyether copolymer 美国陶氏有机硅公司 2021-09-14 CN disclosed
CN-110997840-B Silicone-polyether copolymers, isocyanate-functionalized silicone-polyether copolymers formed therewith, silicone-polyether-urethane copolymers, sealants including the same, and related methods 美国陶氏有机硅公司 2021-09-07 CN disclosed