SCHEMBL28641995

SCHEMBL28641995

CCc1ccc(O)c(COC)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 1/20 0.55
BACE1 P56817 1/20 0.49
ALDH1A1 P00352 3/20 0.44
PRKCE Q02156 3/20 0.44
MYLK Q15746 2/20 0.44
TDP1 Q9NUW8 2/20 0.44
MEN1 O00255 1/20 0.44
PRKCG P05129 1/20 0.44
MAPT P10636 1/20 0.44
PRKCA P17252 1/20 0.44
APEX1 P27695 1/20 0.44
RECQL P46063 1/20 0.44
KMT2A Q03164 1/20 0.44
POLB P06746 3/20 0.44
ALOX12 P18054 2/20 0.43
TP53 P04637 1/20 0.43
CYP1A2 P05177 1/20 0.43
CYP3A4 P08684 1/20 0.43
CYP2C9 P11712 1/20 0.43
HPGD P15428 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25446709 0.88 PRKCE (0.47) TRPA1BACE1ALDH1A1PRKCEMYLK
SCHEMBL28651034 0.85 CNR1 (0.56) BACE1ALDH1A1PRKCEMYLKTDP1
SCHEMBL28425129 0.85 BACE1 (0.58) TRPA1BACE1ALDH1A1PRKCEMYLK
SCHEMBL25460973 0.85 PRKCE (0.44) TRPA1BACE1ALDH1A1PRKCEMYLK
SCHEMBL28637165 0.82 NPC1 (0.49) BACE1ALDH1A1TP53CYP3A4HPGD
SCHEMBL1021944 0.81 BACE1 (0.68) TRPA1BACE1ALDH1A1MAPTPOLB
SCHEMBL8750671 0.80 TDP1 (0.42) TRPA1BACE1ALDH1A1PRKCEMYLK
SCHEMBL51319 0.79 TRPA1 (0.64) TRPA1BACE1ALDH1A1MEN1MAPT
SCHEMBL6712520 0.79 PRKCE (0.50) ALDH1A1PRKCEMYLKTDP1MEN1
SCHEMBL11449239 0.79 ALDH1A1 (0.61) ALDH1A1PRKCEMYLKTDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
CN-109153841-B Resin composition 东丽株式会社 2021-12-31 CN disclosed
CN-113820920-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-12-21 CN disclosed
CN-107850844-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-09-07 CN disclosed