SCHEMBL2865193

SCHEMBL2865193

CCO[SiH2]c1cccc(N)c1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.48
TP53 P04637 1/20 0.48
CASP1 P29466 2/20 0.41
RECQL P46063 1/20 0.41
ALDH1A1 P00352 5/20 0.39
TSHR P16473 1/20 0.39
KDM4E B2RXH2 3/20 0.35
CA12 O43570 1/20 0.34
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
CA7 P43166 1/20 0.34
CA9 Q16790 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
CA14 Q9ULX7 1/20 0.34
MAOB P27338 4/20 0.34
MAOA P21397 3/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
MAPT P10636 2/20 0.33
CYP19A1 P11511 1/20 0.33
GAA P10253 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19879408 0.78 ACHE (0.42) CYP3A4TP53ALDH1A1TDP1MAOB
SCHEMBL9401853 0.78 ALDH1A1 (0.48) CYP3A4TP53CASP1RECQLALDH1A1
SCHEMBL2804398 0.75 TDP1 (0.46) CYP3A4TP53RECQLALDH1A1TSHR
SCHEMBL28923184 0.75 TAAR1 (0.49) TSHRKDM4ESMN1; SMN2NOS1
SCHEMBL703521 0.74 LTA4H (0.37) TP53ALDH1A1TSHRMEN1KMT2A
SCHEMBL1172590 0.74 CYP3A4 (0.42) CYP3A4TP53CASP1RECQLALDH1A1
SCHEMBL28386904 0.72 ALDH1A1 (0.45) CYP3A4TP53CASP1ALDH1A1TSHR
Ethyne SCHEMBL28268842 0.71 LTA4H (0.34) TP53ALDH1A1TSHR
SCHEMBL27988645 0.70 CYP3A4 (0.60) CYP3A4TP53CASP1RECQLALDH1A1
SCHEMBL19528658 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
CN-114055975-B Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2023-05-12 CN disclosed
CN-114055975-A Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2022-02-18 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
EP-3067395-B1 ULTRAVIOLET RADIATION-CURABLE COMPOSITION, AND RECORDED MATTER SEIKO EPSON CORP (JP) 2020-10-28 EP disclosed
US-10392522-B2 Ultraviolet curable composition and recorded object SEIKO EPSON CORPORATION (JP) 2019-08-27 US disclosed
US-10300708-B2 Ink jet composition, housing, and ink jet method SEIKO EPSON CORPORATION (JP) 2019-05-28 US disclosed
US-10279603-B2 Production method of recording material, and recording material SEIKO EPSON CORPORATION (JP) 2019-05-07 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-9956726-B2 Apparatus for producing three-dimensional structure, method of producing three-dimensional structure, and three-dimensional structure SEIKO EPSON CORPORATION (JP) 2018-05-01 US disclosed
US-8322033-B2 Method for forming a conductive post for a multilayered wiring substrate SEIKO EPSON CORPORATION (JP) 2012-12-04 US disclosed
US-7776397-B2 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2010-08-17 US disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 US disclosed
US-20090071706-A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-19 US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed