Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 7/20 | 0.46 |
| ▸ | TSHR | P16473 | 5/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 8/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | MAOA | P21397 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.37 |
| ▸ | GFER | P55789 | 2/20 | 0.37 |
| ▸ | PSMD14 | O00487 | 1/20 | 0.37 |
| ▸ | RECQL | P46063 | 1/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 3/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | ACHE | P22303 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3481787 | 0.79 | ACHE (0.38) | TDP1CYP3A4ALDH1A1MAPTACHE | |
| SCHEMBL27999545 | 0.78 | HRH3 (0.41) | LOXL2 | |
| SCHEMBL3481907 | 0.77 | LPL (0.41) | TDP1TSHRLMNAALDH1A1MAPK1 | |
| SCHEMBL31416082 | 0.77 | LMNA (0.36) | TDP1TSHRCYP3A4LMNACYP1A2 | |
| SCHEMBL703521 | 0.76 | LTA4H (0.37) | TSHRALDH1A1L3MBTL1MEN1KMT2A | |
| SCHEMBL28164375 | 0.76 | CA1 (0.48) | TDP1CYP3A4ALDH1A1MAPK1RECQL | |
| SCHEMBL2865193 | 0.75 | CYP3A4 (0.48) | TDP1TSHRCYP3A4MAOAALDH1A1 | |
| SCHEMBL8579309 | 0.73 | TDP1 (0.46) | TDP1TSHRCYP3A4ALDH1A1MAPK1 | |
| SCHEMBL29159188 | 0.73 | — | — | |
| Ethyne SCHEMBL28268842 | 0.73 | LTA4H (0.34) | TSHRALDH1A1L3MBTL1ACHETP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12109812-B2 | Ink jet printing method and ink jet printing apparatus | SEIKO EPSON CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| CN-114055975-B | Ink jet recording method and ink jet recording apparatus | 精工爱普生株式会社 | 2023-05-12 | — | — | CN | disclosed |
| CN-114055975-A | Ink jet recording method and ink jet recording apparatus | 精工爱普生株式会社 | 2022-02-18 | — | — | CN | disclosed |
| US-20220032618-A1 | Ink Jet Printing Method And Ink Jet Printing Apparatus | SEIKO EPSON CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| EP-3067395-B1 | ULTRAVIOLET RADIATION-CURABLE COMPOSITION, AND RECORDED MATTER | SEIKO EPSON CORP (JP) | 2020-10-28 | — | — | EP | disclosed |
| US-10759119-B2 | Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object | SEIKO EPSON CORPORATION (JP) | 2020-09-01 | — | — | US | disclosed |
| US-10392522-B2 | Ultraviolet curable composition and recorded object | SEIKO EPSON CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| US-10300708-B2 | Ink jet composition, housing, and ink jet method | SEIKO EPSON CORPORATION (JP) | 2019-05-28 | — | — | US | disclosed |
| US-10279603-B2 | Production method of recording material, and recording material | SEIKO EPSON CORPORATION (JP) | 2019-05-07 | — | — | US | disclosed |
| US-10259208-B2 | Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2019-04-16 | — | — | US | disclosed |
| EP-2168757-A1 | METHOD FOR PRODUCING PLASTIC LENS | Hoya Corporation (JP) | 2010-03-31 | — | — | EP | disclosed |
| US-20090077798-A1 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |
| CN-101394714-A | Method for producing multilayered wiring substrate, multilayered wiring substrate, and electronic apparatus | SEIKO EPSON CORP (JP) | 2009-03-25 | — | — | CN | disclosed |
| US-20090071706-A1 | METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-19 | — | — | US | disclosed |
| US-7500895-B2 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20080317943-A1 | METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | SEIKO EPSON CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080311285-A1 | CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD | SEIKO EPSON CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20060127563-A1 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20060019034-A1 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20050287392-A1 | Organic electroluminescent device, method for producing the same, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2005-12-29 | — | — | US | disclosed |