SCHEMBL28670784

SCHEMBL28670784

C[SiH2]OCCCOCCc1ccccc1

nearest known ligand 0.51

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
HRH3 Q9Y5N1 4/20 0.41
IDO1 P14902 1/20 0.40
KCNH2 Q12809 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
ALDH1A1 P00352 1/20 0.39
HPGD P15428 1/20 0.39
RAB9A P51151 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37
CA9 Q16790 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705170 0.85 IDO1 (0.55) MEN1KMT2AIDO1KCNH2L3MBTL1
SCHEMBL704523 0.85 CA1 (0.44) IDO1TDP1ALDH1A1HPGDRAB9A
SCHEMBL28693706 0.84 TSHR (0.50) MEN1KMT2AHRH3IDO1TDP1
SCHEMBL703011 0.83 IDO1 (0.48) IDO1TDP1L3MBTL1
SCHEMBL29415991 0.83 MEN1 (0.40) MEN1KMT2AHRH3IDO1KCNH2
SCHEMBL29568866 0.80 HRH3 (0.40) MEN1KMT2AHRH3IDO1KCNH2
SCHEMBL28130088 0.78 IDO1 (0.61) MEN1KMT2AHRH3IDO1
SCHEMBL22654136 0.78 MEN1 (0.39) MEN1KMT2AHRH3IDO1KCNH2
SCHEMBL198134 0.78 TSHR (0.52) MEN1KMT2AHRH3IDO1TDP1
SCHEMBL144042 0.77 ALDH1A1 (0.54) MEN1KMT2AHRH3IDO1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
CN-108389512-B Laminate, flexible device, and method for producing laminate 东京应化工业株式会社 2022-04-15 CN disclosed
CN-108250754-B Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2022-01-25 CN disclosed