SCHEMBL703011

SCHEMBL703011

C[SiH2]OCCCCc1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 1/20 0.48
L3MBTL1 Q9Y468 2/20 0.47
MAOA P21397 1/20 0.47
TDP1 Q9NUW8 1/20 0.46
SIGMAR1 Q99720 4/20 0.46
MAOB P27338 2/20 0.45
FFAR1 O14842 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705170 0.94 IDO1 (0.55) IDO1L3MBTL1MAOASIGMAR1
SCHEMBL704523 0.85 CA1 (0.44) IDO1TDP1
SCHEMBL28670784 0.83 MEN1 (0.41) IDO1L3MBTL1TDP1
SCHEMBL702731 0.81 IDO1 (0.46) IDO1L3MBTL1MAOATDP1SIGMAR1
SCHEMBL706090 0.80 KCNH2 (0.45) IDO1L3MBTL1MAOATDP1SIGMAR1
SCHEMBL707596 0.79 IDO1 (0.44) IDO1L3MBTL1MAOATDP1SIGMAR1
SCHEMBL707197 0.79 IDO1 (0.44) IDO1L3MBTL1MAOATDP1SIGMAR1
SCHEMBL28693706 0.77 TSHR (0.50) IDO1L3MBTL1TDP1
SCHEMBL2096243 0.77 L3MBTL1 (0.54) IDO1L3MBTL1MAOATDP1SIGMAR1
SCHEMBL198056 0.76 IDO1 (0.58) IDO1L3MBTL1MAOATDP1SIGMAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed