SCHEMBL2869746

SCHEMBL2869746

CN(C)c1n(C)cc[n+]1C

nearest known ligand 0.50

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
HDAC8 Q9BY41 4/20 0.50
APOBEC3A P31941 2/20 0.40
APOBEC3G Q9HC16 2/20 0.40
POLB P06746 1/20 0.40
CTDSP1 Q9GZU7 1/20 0.40
NPSR1 Q6W5P4 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
KDM4E B2RXH2 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL17102688 0.88 HDAC8 (0.41) HDAC8APOBEC3AAPOBEC3GPOLBCTDSP1
Sulfuric Acid SCHEMBL17102586 0.85 HDAC8 (0.38) HDAC8APOBEC3AAPOBEC3GPOLBCTDSP1
SCHEMBL17102702 0.82 HTT (0.37) HDAC8APOBEC3AAPOBEC3GPOLBCTDSP1
SCHEMBL2856690 0.71 CA1 (0.37) HDAC8APOBEC3AAPOBEC3GPOLBCTDSP1
SCHEMBL2869996 0.71 LMNA (0.38) HDAC8APOBEC3AAPOBEC3GPOLBCTDSP1
SCHEMBL2865198 0.67 HDAC8 (0.36) HDAC8
SCHEMBL2869037 0.67 ACHE (0.34)
SCHEMBL329129 0.67
SCHEMBL22349236 0.65
SCHEMBL12201262 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12466956-B2 Electroconductive resin composition and molded article of same DENKA COMPANY LIMITED (JP) 2025-11-11 US disclosed
WO-2023189133-A1 CONDUCTIVE RESIN COMPOSITION デンカ株式会社 2023-10-05 WO disclosed
CN-112601786-B Conductive resin composition and molded article thereof 电化株式会社 2023-05-05 CN disclosed
US-20220392373-A1 MUCOSAL TISSUE MODEL DENKA COMPANY LIMITED (JP) 2022-12-08 US disclosed
EP-4083969-A1 MUCOSAL TISSUE MODEL Denka Company Limited (JP) 2022-11-02 EP disclosed
EP-3845600-B1 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME DENKA COMPANY LTD (JP) 2022-10-26 EP disclosed
CN-114787895-A Mucosal tissue model 电化株式会社 2022-07-22 CN disclosed
US-20210246314-A1 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME DENKA COMPANY LIMITED (JP) 2021-08-12 US disclosed
EP-3845600-A1 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME Denka Company Limited (JP) 2021-07-07 EP disclosed
CN-112601786-A Conductive resin composition and molded article thereof 电化株式会社 2021-04-02 CN disclosed
US-20080233438-A1 Fuel for fuel cell, fuel cell and application thereof KURITA WATER INDUSTRIES LTD. (JP) 2008-09-25 US disclosed
US-20080094777-A1 Electric double layer capacitor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2008-04-24 US disclosed
EP-1905740-A1 ELECTRIC DOUBLE LAYER CAPACITOR Sumitomo Chemical Company, Limited (JP) 2008-04-02 EP disclosed
EP-1876611-A1 ELECTRIC DOUBLE LAYER CAPACITOR Sumitomo Chemical Company, Limited (JP) 2008-01-09 EP disclosed
US-20070269987-A1 Polishing Liquid for Cmp Process and Polishing Method SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2007-11-22 US disclosed
EP-1808875-A1 ELECTROLYTE FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR UTILIZING THE SAME MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2007-07-18 EP disclosed
EP-1705740-A1 FUEL FOR FUEL CELL, FUEL CELL AND APPLICATION THEREOF Kurita Water Industries Ltd. (JP) 2006-09-27 EP disclosed
EP-1628334-A1 POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD SANYO CHEMICAL INDUSTRIES LTD. (JP) 2006-02-22 EP disclosed
US-20050136247-A1 Non-aqueous absorbent and use thereof SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2005-06-23 US disclosed
EP-1462460-A1 NON-AQUEOUS ABSORBENT AND USE THEREOF SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-09-29 EP disclosed