Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3844505 | 0.84 | TDP1 (0.35) | TSHR | |
| SCHEMBL27598692 | 0.78 | TP53 (0.33) | TSHR | |
| SCHEMBL25281051 | 0.76 | LTA4H (0.31) | LTA4HTSHR | |
| SCHEMBL28512650 | 0.74 | CA4 (0.32) | LTA4HTSHR | |
| SCHEMBL11232827 | 0.74 | LTA4H (0.30) | LTA4HTSHR | |
| SCHEMBL548074 | 0.74 | LTA4H (0.30) | LTA4HTSHR | |
| SCHEMBL4754321 | 0.71 | MAOA (0.31) | — | |
| SCHEMBL3848285 | 0.70 | CA1 (0.31) | — | |
| SCHEMBL28031217 | 0.70 | CHRNB2 (0.31) | LTA4H | |
| SCHEMBL8039521 | 0.68 | PNMT (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115122735-B | Polyimide, resin composition, resin film, laminate, cover film, resin-coated copper foil, metal-clad laminate, and circuit board | NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) | 2026-05-26 | — | — | CN | disclosed |
| CN-119899530-A | Polyimide composition, resin film, laminate, cover film, resin-coated copper foil, metal-coated laminate, and circuit board | 日铁化学材料株式会社 | 2025-04-29 | — | — | CN | disclosed |
| CN-119899529-A | Resin composition, resin film, laminate, cover film, resin-coated copper foil, metal-coated laminate, and circuit board | 日铁化学材料株式会社 | 2025-04-29 | — | — | CN | disclosed |
| CN-114502658-B | Resin composition, resin film, laminate, cover film, resin-coated copper foil, metal-coated laminate, and circuit board | 日铁化学材料株式会社 | 2025-02-14 | — | — | CN | disclosed |
| CN-110088169-B | Method for preparing polyetherimide | 高新特殊工程塑料全球技术有限公司 | 2022-07-12 | — | — | CN | disclosed |