SCHEMBL28909699

SCHEMBL28909699

CCc1ccccc1Oc1c2ccccc2c(C)c2ccccc12

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 3/20 0.47
MAPT P10636 2/20 0.47
NPSR1 Q6W5P4 1/20 0.47
SLC6A4 P31645 5/20 0.41
SLC6A2 P23975 4/20 0.41
SLC6A3 Q01959 3/20 0.41
CYP4F2 P78329 2/20 0.39
CYP4A11 Q02928 2/20 0.39
KMT2A Q03164 1/20 0.39
KDM4E B2RXH2 1/20 0.39
HPGD P15428 1/20 0.38
ATM Q13315 1/20 0.38
AR P10275 1/20 0.37
HTR2A P28223 1/20 0.36
RIPK1 Q13546 1/20 0.35
NISCH Q9Y2I1 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28909700 0.81 SLC6A4 (0.42) L3MBTL1MAPTNPSR1SLC6A4SLC6A2
SCHEMBL475213 0.78 L3MBTL1 (0.57) L3MBTL1MAPTNPSR1SLC6A4SLC6A2
SCHEMBL28909697 0.77 SMN1; SMN2 (0.48) NPSR1KMT2AKDM4EHPGDAR
SCHEMBL11667401 0.73 SLC6A2 (0.49) L3MBTL1MAPTNPSR1SLC6A4SLC6A2
SCHEMBL22167219 0.73 SLC6A2 (0.46) L3MBTL1MAPTNPSR1SLC6A4SLC6A2
SCHEMBL2856382 0.73 GABRA1 (0.47) L3MBTL1MAPTNPSR1SLC6A4SLC6A2
SCHEMBL30660757 0.72 ALDH1A1 (0.42) L3MBTL1MAPTKMT2AKDM4EHPGD
SCHEMBL1127926 0.72 ALDH1A1 (0.42) L3MBTL1MAPTKMT2AKDM4EHPGD
SCHEMBL979986 0.71 L3MBTL1 (0.43) L3MBTL1MAPTNPSR1SLC6A4SLC6A2
Ethylene Glycol SCHEMBL6229573 0.71 MAPT (0.50) L3MBTL1MAPTNPSR1SLC6A4SLC6A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109799680-B Chemically amplified positive photosensitive resin composition and use thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-108241257-B Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating 奇美实业股份有限公司 2022-11-08 CN disclosed