SCHEMBL28914293

SCHEMBL28914293

OCC(c1ccccc1)N(c1ccccc1)c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
NR1H2 P55055 3/20 0.43
NR1H3 Q13133 3/20 0.43
TRPA1 O75762 3/20 0.41
SLC6A2 P23975 3/20 0.38
SLC6A4 P31645 3/20 0.38
KDM4E B2RXH2 2/20 0.38
ALDH1A1 P00352 1/20 0.38
HTR2A P28223 2/20 0.37
HRH1 P35367 1/20 0.37
LMNA P02545 1/20 0.37
SRC P12931 1/20 0.37
TP53 P04637 1/20 0.37
MAPT P10636 1/20 0.37
AOC3 Q16853 1/20 0.36
GSR P00390 1/20 0.36
TAAR1 Q96RJ0 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.35
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10007040 0.81 TRPA1 (0.43) NR1H2NR1H3TRPA1KDM4EALDH1A1
SCHEMBL1205734 0.77 KDM4E (0.52) NR1H2NR1H3TRPA1SLC6A2SLC6A4
SCHEMBL817422 0.77 KDM4E (0.52) NR1H2NR1H3TRPA1SLC6A2SLC6A4
SCHEMBL7093914 0.77 TAAR1 (0.52) SLC6A2SLC6A4HTR2AHRH1TAAR1
SCHEMBL1206432 0.77 KDM4E (0.52) NR1H2NR1H3TRPA1SLC6A2SLC6A4
SCHEMBL2784537 0.77 GABBR2 (0.48) ALDH1A1LMNASRCMAPTL3MBTL1
SCHEMBL5025843 0.77 UTS2R (0.41) NR1H2NR1H3SLC6A2SLC6A4TP53
SCHEMBL5403210 0.74 NR1H2 (0.48) NR1H2NR1H3TRPA1KDM4EALDH1A1
SCHEMBL4202700 0.74 KDM4E (0.44) NR1H2NR1H3TRPA1SLC6A2SLC6A4
SCHEMBL29257469 0.74 TRPA1 (0.40) TRPA1SLC6A2SLC6A4KDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113844039-A Preparation method of novel low-dielectric-constant copper-clad plate glue solution 山东金宝电子股份有限公司 2021-12-28 CN claimed
CN-114710886-B Ink hole plugging method for high-heat-conductivity PCB 深圳市板明科技股份有限公司 2022-08-19 CN disclosed
CN-114710886-A Ink hole plugging method for high-heat-conductivity PCB 深圳市板明科技股份有限公司 2022-07-05 CN disclosed
CN-112961380-A Two-dimensional high-thermal-conductivity carbon fiber reinforced resin matrix composite material and preparation method thereof 航天材料及工艺研究所 2021-06-15 CN disclosed