SCHEMBL28994572

SCHEMBL28994572

CCCCO[Si](O)(OC)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.41
TSHR P16473 4/20 0.39
L3MBTL1 Q9Y468 3/20 0.39
TDP1 Q9NUW8 2/20 0.39
CYP1A2 P05177 3/20 0.36
CYP2C19 P33261 3/20 0.36
CYP2C9 P11712 2/20 0.36
MAPK1 P28482 3/20 0.36
ALDH1A1 P00352 2/20 0.36
CYP3A4 P08684 2/20 0.36
CYP2D6 P10635 1/20 0.35
CYP19A1 P11511 1/20 0.35
TP53 P04637 1/20 0.34
HSD17B10 Q99714 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.33
KDM4E B2RXH2 1/20 0.33
POLB P06746 1/20 0.33
PCSK9 Q8NBP7 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19809220 0.89 LMNA (0.38) LTA4HTSHRL3MBTL1TDP1CYP1A2
SCHEMBL28693226 0.88 LTA4H (0.42) LTA4HTSHRL3MBTL1TDP1CYP1A2
SCHEMBL19809188 0.86 LTA4H (0.44) LTA4HTSHRMAPK1ALDH1A1CYP3A4
SCHEMBL17391641 0.82 LTA4H (0.43) LTA4HTSHRL3MBTL1TDP1CYP1A2
SCHEMBL10907580 0.82 LTA4H (0.43) LTA4HTSHRL3MBTL1TDP1CYP1A2
SCHEMBL18043734 0.82 TSHR (0.35) LTA4HTSHRL3MBTL1MAPK1ALDH1A1
SCHEMBL19809442 0.81 LTA4H (0.41) LTA4HTSHRMAPK1ALDH1A1CYP3A4
SCHEMBL28218853 0.81 LTA4H (0.37) LTA4HTSHRL3MBTL1TDP1CYP1A2
SCHEMBL1686817 0.80 LTA4H (0.44) LTA4HTSHRL3MBTL1TDP1CYP1A2
SCHEMBL2473998 0.80 LTA4H (0.44) LTA4HTSHRL3MBTL1TDP1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed