Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 2/20 | 0.44 |
| ▸ | TSHR | P16473 | 4/20 | 0.42 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.42 |
| ▸ | CYP2C9 | P11712 | 3/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.38 |
| ▸ | CYP2D6 | P10635 | 3/20 | 0.38 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.38 |
| ▸ | TP53 | P04637 | 1/20 | 0.37 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.37 |
| ▸ | PCSK9 | Q8NBP7 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8034448 | 0.93 | TSHR (0.45) | LTA4HTSHRCYP3A4ALDH1A1MAPK1 | |
| SCHEMBL8048262 | 0.93 | TSHR (0.45) | LTA4HTSHRCYP3A4ALDH1A1MAPK1 | |
| SCHEMBL1686817 | 0.85 | LTA4H (0.44) | LTA4HTSHRL3MBTL1TDP1CYP2C9 | |
| SCHEMBL8052071 | 0.84 | SOAT2 (0.45) | ALDH1A1 | |
| SCHEMBL8052068 | 0.84 | SOAT2 (0.45) | ALDH1A1 | |
| SCHEMBL28693226 | 0.81 | LTA4H (0.42) | LTA4HTSHRL3MBTL1TDP1CYP2C9 | |
| SCHEMBL28994572 | 0.80 | LTA4H (0.41) | LTA4HTSHRL3MBTL1TDP1CYP2C9 | |
| SCHEMBL431558 | 0.80 | LTA4H (0.47) | LTA4HTSHRL3MBTL1TDP1CYP2C9 | |
| SCHEMBL705748 | 0.80 | DUT (0.47) | LTA4HTSHRL3MBTL1TDP1CYP2C9 | |
| SCHEMBL431649 | 0.80 | LTA4H (0.47) | LTA4HTSHRL3MBTL1TDP1CYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120153318-A | Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film | 旭化成株式会社 | 2025-06-13 | — | — | CN | disclosed |
| WO-2024210063-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, CURED FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2024-10-10 | — | — | WO | disclosed |
| US-20240101761-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-03-28 | — | — | US | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| CN-115755526-A | Photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115039029-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-107870516-B | Positive photosensitive resin composition, patterned film and method for manufacturing bump | 奇美实业股份有限公司 | 2022-08-02 | — | — | CN | disclosed |
| WO-2022154020-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | 旭化成株式会社 | 2022-07-21 | — | — | WO | disclosed |
| US-20220011669-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-01-13 | — | — | US | disclosed |
| US-11163234-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-11-02 | — | — | US | disclosed |
| US-8461699-B2 | Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| WO-2012126766-A1 | N-(3-CARBAMOYLPHENYL)-1H-PYRAZOLE-5-CARBOXAMIDE DERIVATIVES AND THE USE THEREOF FOR CONTROLLING ANIMAL PESTS | BAYER CROPSCIENCE AG (DE) | 2012-09-27 | — | — | WO | disclosed |
| EP-2469337-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20110254178-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-20 | — | — | US | disclosed |
| EP-2372457-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2011-10-05 | — | — | EP | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
| EP-1412346-A1 | METHOD FOR PRODUCING NOVEL SPINOSYN DERIVATIVES | Bayer CropScience AG (DE) | 2004-04-28 | — | — | EP | disclosed |
| WO-2003010155-A1 | METHOD FOR PRODUCING NOVEL SPINOSYN DERIVATIVES | BAYER CROPSCIENCE AG (DE) | 2003-02-06 | — | — | WO | disclosed |