SCHEMBL29008162

SCHEMBL29008162

CCCC(=O)C(O)(c1ccccc1)c1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 2/20 0.53
LMNA P02545 1/20 0.53
HTT P42858 1/20 0.53
CES2 O00748 1/20 0.46
CES1 P23141 1/20 0.46
CHRM2 P08172 2/20 0.45
CHRM4 P08173 2/20 0.45
CHRM1 P11229 2/20 0.45
CHRM3 P20309 2/20 0.45
GAA P10253 2/20 0.44
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
ALDH1A1 P00352 2/20 0.44
POLB P06746 1/20 0.44
HPGD P15428 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
CYP2C19 P33261 2/20 0.42
CYP2C9 P11712 1/20 0.42
HIF1A Q16665 1/20 0.42
DRD2 P14416 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL463621 0.83 OPRM1 (0.53) L3MBTL1LMNAHTTCES2CES1
SCHEMBL5873291 0.81 CYP2C9 (0.47) L3MBTL1LMNAHTTCHRM2CHRM4
SCHEMBL28430563 0.80 MAPT (0.53) L3MBTL1LMNAHTTCES2CES1
SCHEMBL8904079 0.76 CES2 (0.42) L3MBTL1LMNAHTTCES2CES1
SCHEMBL9809522 0.76 LMNA (0.42) L3MBTL1LMNAHTTCHRM2CHRM4
Benzylic Acid SCHEMBL11014625 0.74 LMNA (0.51) L3MBTL1LMNAHTTCES2CES1
Benzylic Acid SCHEMBL27794460 0.74 CYP2C9 (0.55) L3MBTL1LMNAHTTCES2CES1
Benzylic Acid SCHEMBL27815601 0.74 CYP2C9 (0.55) L3MBTL1LMNAHTTCES2CES1
Benzylic Acid SCHEMBL27815599 0.74 CYP2C9 (0.55) L3MBTL1LMNAHTTCES2CES1
Butyric Acid SCHEMBL29229892 0.74 HDAC3 (0.50) L3MBTL1LMNAHTTCES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117120573-A Adhesive composition, laminate, method for producing laminate, and method for producing semiconductor substrate 日产化学株式会社 2023-11-24 CN disclosed
CN-116157898-A Laminate, stripper composition, and method for producing processed semiconductor substrate 日产化学株式会社 2023-05-23 CN disclosed