SCHEMBL29060313

SCHEMBL29060313

CC(C(=O)OC[C@H]1O[C@@H](n2cnc3c(=O)[nH]c(N)nc32)[C@H](O)[C@@H]1O)C(=O)c1ccccc1

nearest known ligand 0.69

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
▸ HINT1 P49773 9/20 0.69
▸ GSK3A P49840 2/20 0.68
▸ RPS6KA3 P51812 2/20 0.68
▸ MAPK14 Q16539 2/20 0.68
▸ PNP P00491 1/20 0.63
▸ TAAR1 Q96RJ0 1/20 0.58
▸ NT5E P21589 1/20 0.58
▸ TGM2 P21980 1/20 0.54
▸ KRAS P01116 4/20 0.54
▸ TAS1R3 Q7RTX0 1/20 0.54
▸ TAS1R1 Q7RTX1 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5219707 0.88 GSK3A (0.80) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL1611244 0.87 HINT1 (0.77) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL4733243 0.86 HINT1 (0.76) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL8450059 0.85 HINT1 (0.73) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL217117 0.84 HINT1 (0.80) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL439016 0.83 HINT1 (0.78) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL784432 0.83 HINT1 (0.75) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL7915394 0.83 HINT1 (0.71) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL1138806 0.82 HINT1 (0.71) HINT1GSK3ARPS6KA3MAPK14PNP
SCHEMBL6389635 0.81 TAAR1 (0.59) HINT1GSK3ARPS6KA3MAPK14PNP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110320747-B Curable resin composition, dry film, cured product, and printed wiring board 太阳控股株式会社 2024-03-08 — — CN disclosed
CN-117136216-A Curable resin composition, laminated structure, cured product, and electronic component 太阳控股株式会社 2023-11-28 — — CN disclosed
CN-116449647-A Curable resin composition, dry film, cured product, and printed wiring board 太阳控股株式会社 2023-07-18 — — CN disclosed
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