SCHEMBL29093547

SCHEMBL29093547

O=NNc1ccc2ccccc2c1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN22 Q9Y2R2 1/20 0.48
CHEK1 O14757 1/20 0.48
CDK8 P49336 1/20 0.48
NEK2 P51955 1/20 0.48
LIMK1 P53667 1/20 0.48
LDHA P00338 1/20 0.46
MEN1 O00255 5/20 0.43
KMT2A Q03164 5/20 0.43
KDM4E B2RXH2 3/20 0.43
MAPT P10636 3/20 0.43
GAA P10253 2/20 0.43
ALDH1A1 P00352 2/20 0.43
NPSR1 Q6W5P4 1/20 0.43
RXFP1 Q9HBX9 1/20 0.43
NPC1 O15118 3/20 0.40
RAB9A P51151 3/20 0.40
TDP1 Q9NUW8 2/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
LMNA P02545 1/20 0.40
HTT P42858 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL30182897 0.93 LDHA (0.45) PTPN22CHEK1CDK8NEK2LIMK1
SCHEMBL3842734 0.76 KDM4E (0.52) MEN1KMT2AKDM4EMAPTGAA
Hydrochloric Acid SCHEMBL9365816 0.76 PTPN22 (0.56) PTPN22CHEK1CDK8NEK2LIMK1
SCHEMBL8845568 0.76 PTPN22 (0.56) PTPN22CHEK1CDK8NEK2LIMK1
SCHEMBL9362019 0.76 PTPN22 (0.56) PTPN22CHEK1CDK8NEK2LIMK1
SCHEMBL8701015 0.76 THRB (0.49) PTPN22CHEK1CDK8NEK2LIMK1
SCHEMBL8701010 0.76 THRB (0.49) PTPN22CHEK1CDK8NEK2LIMK1
SCHEMBL20152833 0.76 ALDH1A1 (0.43) PTPN22CHEK1CDK8NEK2LIMK1
Phenol SCHEMBL30295516 0.75 CYP3A4 (0.47) MEN1KMT2AKDM4EMAPTGAA
SCHEMBL14310593 0.75 PTPN22 (0.54) PTPN22CHEK1CDK8NEK2LIMK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110325911-B Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2023-01-06 CN disclosed