Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 5/20 | 0.86 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.86 |
| ▸ | TLR9 | Q9NR96 | 2/20 | 0.86 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.86 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.86 |
| ▸ | POLB | P06746 | 2/20 | 0.86 |
| ▸ | MEN1 | O00255 | 1/20 | 0.86 |
| ▸ | USP2 | O75604 | 1/20 | 0.86 |
| ▸ | RECQL | P46063 | 1/20 | 0.86 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.86 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.86 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.68 |
| ▸ | CRHBP | P24387 | 1/20 | 0.60 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.60 |
| ▸ | MAOB | P27338 | 6/20 | 0.59 |
| ▸ | RAB9A | P51151 | 2/20 | 0.58 |
| ▸ | NPC1 | O15118 | 1/20 | 0.58 |
| ▸ | CASP3 | P42574 | 1/20 | 0.58 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.58 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.58 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2909651 | 1.00 | MAPT (0.86) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL4542807 | 0.94 | MAPT (0.77) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL25221826 | 0.94 | MAPT (0.77) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL5950679 | 0.94 | MAPT (0.77) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL25194301 | 0.94 | MAPT (0.77) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL25218075 | 0.94 | MAPT (0.77) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL4542805 | 0.94 | MAPT (0.77) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL5950678 | 0.94 | MAPT (0.77) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL11521555 | 0.93 | MAPT (1.00) | MAPTMAPK1TLR9KMT2AALDH1A1 | |
| SCHEMBL11311936 | 0.93 | MAPT (0.75) | MAPTMAPK1TLR9KMT2AALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 284 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100508-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-03-05 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-01-01 | — | — | US | disclosed |
| EP-0505161-A1 | Photosensitive polymer composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1992-09-23 | — | — | EP | disclosed |
| EP-0430220-A2 | Photosensitive resin composition and semiconductor apparatus using it | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0430221-A2 | Photosensitive resin composition | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0355927-A2 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1990-02-28 | — | — | EP | disclosed |
| EP-0203393-B1 | CURABLE COMPOSITION | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1989-07-12 | — | — | EP | disclosed |
| US-4778859-A | Tetramine derived polyimide with pendant unsaturation, and various photosensitive compositions therefrom | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1988-10-18 | — | — | US | disclosed |
| EP-0254230-A2 | Heat-resistant photoresist film | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1988-01-27 | — | — | EP | disclosed |
| EP-0203393-A1 | Curable composition | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1986-12-03 | — | — | EP | disclosed |
| US-4018606-A | Organic azo pigment sensitizers for photoconductive layers | EASTMAN KODAK COMPANY (US) | 1977-04-19 | — | — | US | disclosed |
| US-4018607-A | Crystalline organic pigment sensitizers for photoconductive layers | EASTMAN KODAK COMPANY (US) | 1977-04-19 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (8 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | MAPT 2839/4885MAPK1 2987/4885TLR9 421/4885 |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | MAPT 1027/4885MAPK1 3534/4885TLR9 1627/4885 |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, SAT1, ASIC1 | MAPT 827/4885MAPK1 1339/4885TLR9 1608/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | MAPT 1037/4885MAPK1 1924/4885TLR9 3448/4885 |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, ASIC1, SMARCB1 | MAPT 331/4885MAPK1 3128/4885TLR9 1011/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | MAPT 2658/4885MAPK1 3625/4885TLR9 1067/4885 |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RER1, SEM1, RAD51 | MAPT 2355/4885MAPK1 2564/4885TLR9 1524/4885 |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ARCN1, PBRM1, LCP1 | MAPT 950/4885MAPK1 3470/4885TLR9 803/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.