SCHEMBL29112987

SCHEMBL29112987

COCCCn1c(=O)[nH]c(=O)[nH]c1=O

nearest known ligand 0.50

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.50
ALDH1A1 P00352 3/20 0.47
TLR7 Q9NYK1 1/20 0.44
CYP1A2 P05177 1/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
HTT P42858 1/20 0.40
PDE4A P27815 1/20 0.39
ADORA2A P29274 1/20 0.39
ADORA2B P29275 1/20 0.39
PDE4B Q07343 1/20 0.39
PDE4C Q08493 1/20 0.39
PDE4D Q08499 1/20 0.39
GLA P06280 1/20 0.39
HSD17B10 Q99714 1/20 0.39
RXFP1 Q9HBX9 2/20 0.38
GAA P10253 1/20 0.38
PLK1 P53350 1/20 0.38
KDM4E B2RXH2 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15906884 0.94 L3MBTL1 (0.45) L3MBTL1ALDH1A1TLR7
SCHEMBL2026591 0.78 TYMP (0.38) ALDH1A1HTT
SCHEMBL2784423 0.77 ATM (0.53) L3MBTL1ALDH1A1HTTPDE4AADORA2A
SCHEMBL2847500 0.76 MAPT (0.32) L3MBTL1
SCHEMBL557549 0.76 ADORA2B (0.35) L3MBTL1ALDH1A1TLR7PDE4AADORA2A
SCHEMBL8579776 0.75 MAPT (0.49) L3MBTL1ALDH1A1TLR7GLAGAA
SCHEMBL11709001 0.75 ATM (0.51) L3MBTL1ALDH1A1HTTPDE4AADORA2A
SCHEMBL2048833 0.75 MAPT (0.47) ALDH1A1HTTPDE4AADORA2AADORA2B
SCHEMBL28770509 0.74 MLKL (0.38) L3MBTL1ALDH1A1TLR7HTTGLA
SCHEMBL21772430 0.74 ATM (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117157344-A Resin composition, cured product, laminate, method for producing cured product, semiconductor device, polyimide precursor, and method for producing polyimide precursor 富士胶片株式会社 2023-12-01 CN disclosed
CN-117120512-A Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and polyimide precursor 富士胶片株式会社 2023-11-24 CN disclosed
CN-117120550-A Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-24 CN disclosed
CN-117083346-A Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-17 CN disclosed