SCHEMBL29131801

SCHEMBL29131801

Cc1cccc(Cc2ccc(O)cc2)c1O

nearest known ligand 0.57

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 1/20 0.57
EGFR P00533 2/20 0.50
ERBB2 P04626 2/20 0.50
ESR1 P03372 2/20 0.50
ESR2 Q92731 2/20 0.50
ALDH1A1 P00352 1/20 0.50
TRPA1 O75762 1/20 0.45
ABAT P80404 1/20 0.41
CA12 O43570 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
CA9 Q16790 1/20 0.41
SCN8A Q9UQD0 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10495880 0.87 KEAP1 (0.65) KEAP1ESR1ESR2ABAT
SCHEMBL30171004 0.86 ALDH1A1 (0.52) ALDH1A1TRPA1
SCHEMBL3725692 0.86 ALDH1A1 (0.52) ALDH1A1TRPA1
SCHEMBL16545627 0.85 KEAP1 (0.63) KEAP1ESR1ESR2ABAT
SCHEMBL68936 0.85 ALDH1A1 (0.62) ESR1ESR2ALDH1A1TRPA1CA12
SCHEMBL15468220 0.84 ESR1 (0.50) KEAP1ESR1ESR2ALDH1A1
SCHEMBL7705071 0.84 ESR1 (0.59) KEAP1EGFRERBB2ESR1ESR2
SCHEMBL3926343 0.83 KEAP1 (0.67) KEAP1EGFRERBB2ESR1ESR2
SCHEMBL17666370 0.83 ALDH1A1 (0.59) ALDH1A1TRPA1CA12CA1CA2
SCHEMBL15085754 0.82 GABRA1 (0.44) KEAP1EGFRERBB2ALDH1A1TRPA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117099045-A Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-21 CN disclosed
WO-2022202647-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-09-29 WO disclosed