SCHEMBL15085754

SCHEMBL15085754

CCc1ccc(-c2ccc(Cc3cccc(C)c3O)cc2)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 1/20 0.44
GABRB2 P47870 1/20 0.44
ALDH1A1 P00352 2/20 0.43
TAOK1 Q7L7X3 1/20 0.43
TAOK3 Q9H2K8 1/20 0.43
KDM4E B2RXH2 1/20 0.40
PSMD14 O00487 1/20 0.40
USP2 O75604 1/20 0.40
POLB P06746 1/20 0.40
GAA P10253 1/20 0.40
MAPT P10636 1/20 0.40
ALOX12 P18054 1/20 0.40
HTT P42858 1/20 0.40
HSD17B10 Q99714 1/20 0.40
ALOX5 P09917 1/20 0.40
PTGS1 P23219 1/20 0.40
PTGS2 P35354 1/20 0.40
EGFR P00533 3/20 0.40
TRPA1 O75762 1/20 0.39
CA12 O43570 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29131801 0.82 KEAP1 (0.57) ALDH1A1EGFRTRPA1CA12CA1
SCHEMBL30171004 0.80 ALDH1A1 (0.52) ALDH1A1ALOX5TRPA1
SCHEMBL3725692 0.80 ALDH1A1 (0.52) ALDH1A1ALOX5TRPA1
SCHEMBL68936 0.79 ALDH1A1 (0.62) GABRA1GABRB2ALDH1A1KDM4EHSD17B10
SCHEMBL13839296 0.78 GABRA1 (0.68) GABRA1GABRB2ALDH1A1KDM4EPOLB
SCHEMBL12856364 0.78 GABRA1 (0.68) GABRA1GABRB2ALDH1A1KDM4EPOLB
SCHEMBL27561169 0.77 GABRA1 (0.45) GABRA1GABRB2ALDH1A1EGFRCA2
SCHEMBL17666370 0.77 ALDH1A1 (0.59) GABRA1GABRB2ALDH1A1KDM4EHSD17B10
SCHEMBL263474 0.77 GABRA1 (0.73) GABRA1GABRB2ALDH1A1KDM4EPOLB
SCHEMBL31229333 0.77 GABRA1 (0.73) GABRA1GABRB2ALDH1A1KDM4EPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9029270-B2 Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor ASAHI KASEI E-MATERIALS CORPORATION (JP) 2015-05-12 US disclosed
US-20130168829-A1 PHENOLIC RESIN COMPOSITION, AND METHODS FOR MANUFACTURING CURED RELIEF PATTERN AND SEMICONDUCTOR ASAHI KASEI E-MATERIALS CORPORATION (JP) 2013-07-04 US disclosed