SCHEMBL29152102

SCHEMBL29152102

O=C1C(=CC=Cc2ccccc2)Cc2ccccc21

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MIF P14174 6/20 0.66
▸ MAOB P27338 3/20 0.66
▸ MAOA P21397 3/20 0.66
▸ KDM4E B2RXH2 3/20 0.54
▸ MAPT P10636 3/20 0.54
▸ ALDH1A1 P00352 2/20 0.54
▸ LMNA P02545 2/20 0.54
▸ SMN1; SMN2 Q16637 2/20 0.54
▸ GAA P10253 1/20 0.54
▸ HTT P42858 1/20 0.54
▸ ACHE P22303 2/20 0.53
▸ MEN1 O00255 1/20 0.51
▸ KMT2A Q03164 1/20 0.51
▸ CYP19A1 P11511 2/20 0.51
▸ TNF P01375 2/20 0.51
▸ NPC1 O15118 1/20 0.50
▸ RAB9A P51151 1/20 0.50
▸ NPSR1 Q6W5P4 1/20 0.50
▸ STK17B O94768 1/20 0.48
▸ ABCB1 P08183 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL813820 0.84 MAOB (0.71) MIFMAOBMAOAKDM4EMAPT
SCHEMBL5356129 0.84 MAOB (0.71) MIFMAOBMAOAKDM4EMAPT
SCHEMBL30462577 0.80 MAOB (1.00) MIFMAOBMAOAKDM4EMAPT
SCHEMBL30977980 0.80 MAOB (1.00) MIFMAOBMAOAKDM4EMAPT
SCHEMBL3694617 0.80 MAOB (1.00) MIFMAOBMAOAKDM4EMAPT
SCHEMBL30462578 0.80 MAOB (1.00) MIFMAOBMAOAKDM4EMAPT
SCHEMBL2981650 0.80 MAOB (1.00) MIFMAOBMAOAKDM4EMAPT
SCHEMBL3700238 0.80 MAOB (1.00) MIFMAOBMAOAKDM4EMAPT
SCHEMBL25843205 0.77 MAOB (0.68) MIFMAOBMAOAMAPTALDH1A1
SCHEMBL2453186 0.76 MIF (0.59) MIFMAOBMAOAKDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117378044-A Polyimide-containing part forming composition, method for producing bonded body, method for producing device, and device 富士胶片株式会社 2024-01-09 — — CN disclosed
CN-117203746-A Method for manufacturing bonded body, method for manufacturing semiconductor device, and resin composition 富士胶片株式会社 2023-12-08 — — CN disclosed
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