Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOB | P27338 | 5/20 | 0.71 |
| ▸ | MAOA | P21397 | 4/20 | 0.71 |
| ▸ | ABCB1 | P08183 | 1/20 | 0.65 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.54 |
| ▸ | MEN1 | O00255 | 1/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.54 |
| ▸ | APP | P05067 | 6/20 | 0.52 |
| ▸ | MAPT | P10636 | 5/20 | 0.52 |
| ▸ | SNCA | P37840 | 5/20 | 0.52 |
| ▸ | ACHE | P22303 | 3/20 | 0.52 |
| ▸ | TXNRD1 | Q16881 | 1/20 | 0.51 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.49 |
| ▸ | BCHE | P06276 | 1/20 | 0.49 |
| ▸ | MIF | P14174 | 2/20 | 0.48 |
| ▸ | METAP1 | P53582 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL813820 | 1.00 | MAOB (0.71) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL29152102 | 0.84 | MIF (0.66) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL29456881 | 0.83 | MAOB (1.00) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL51711 | 0.83 | MAOB (1.00) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL51712 | 0.83 | MAOB (1.00) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL14936451 | 0.79 | ABCB1 (1.00) | MAOBMAOAABCB1APPACHE | |
| SCHEMBL34475322 | 0.78 | MAOB (0.70) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL12386751 | 0.77 | APP (0.69) | MEN1KMT2AAPPMAPTSNCA | |
| SCHEMBL1454822 | 0.77 | APP (0.69) | MEN1KMT2AAPPMAPTSNCA | |
| SCHEMBL2502424 | 0.77 | TXNRD1 (0.65) | ABCB1MEN1KMT2AAPPMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100508-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2025110009-A1 | CURABLE COMPOSITION, METHOD FOR PRODUCING PIXEL, FILM, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND PHOTOPOLYMERIZATION INITIATOR | 富士フイルム株式会社 | 2025-05-30 | — | — | WO | disclosed |
| WO-2025110008-A1 | CURABLE COMPOSITION, METHOD FOR PRODUCING PIXEL, FILM, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND PHOTOPOLYMERIZATION INITIATOR | 富士フイルム株式会社 | 2025-05-30 | — | — | WO | disclosed |
| WO-2025094724-A1 | CURABLE COMPOSITION, METHOD FOR PRODUCING PIXEL, FILM, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND PHOTOPOLYMERIZATION INITIATOR | 富士フイルム株式会社 | 2025-05-08 | — | — | WO | disclosed |
| WO-2025041644-A1 | CURABLE COMPOSITION, METHOD FOR PRODUCING PIXEL, FILM, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, COMPOUND, AND PHOTOSENSITIZER | 富士フイルム株式会社 | 2025-02-27 | — | — | WO | disclosed |
| CN-119213364-A | Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film | 旭化成株式会社 | 2024-12-27 | — | — | CN | disclosed |
| CN-111954847-B | Photosensitive conductive paste and method for producing patterned green sheet using same | 东丽株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| WO-2022145355-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED OBJECT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-07-07 | — | — | WO | disclosed |
| US-7282323-B2 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| US-20050244739-A1 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| EP-1536286-A1 | HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |