Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOB | P27338 | 5/20 | 0.71 |
| ▸ | MAOA | P21397 | 4/20 | 0.71 |
| ▸ | ABCB1 | P08183 | 1/20 | 0.65 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.54 |
| ▸ | MEN1 | O00255 | 1/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.54 |
| ▸ | APP | P05067 | 6/20 | 0.52 |
| ▸ | MAPT | P10636 | 5/20 | 0.52 |
| ▸ | SNCA | P37840 | 5/20 | 0.52 |
| ▸ | ACHE | P22303 | 3/20 | 0.52 |
| ▸ | TXNRD1 | Q16881 | 1/20 | 0.51 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.49 |
| ▸ | BCHE | P06276 | 1/20 | 0.49 |
| ▸ | MIF | P14174 | 2/20 | 0.48 |
| ▸ | METAP1 | P53582 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5356129 | 1.00 | MAOB (0.71) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL29152102 | 0.84 | MIF (0.66) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL29456881 | 0.83 | MAOB (1.00) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL51711 | 0.83 | MAOB (1.00) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL51712 | 0.83 | MAOB (1.00) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL14936451 | 0.79 | ABCB1 (1.00) | MAOBMAOAABCB1APPACHE | |
| SCHEMBL34475322 | 0.78 | MAOB (0.70) | MAOBMAOAABCB1KDM4EMEN1 | |
| SCHEMBL12386751 | 0.77 | APP (0.69) | MEN1KMT2AAPPMAPTSNCA | |
| SCHEMBL1454822 | 0.77 | APP (0.69) | MEN1KMT2AAPPMAPTSNCA | |
| SCHEMBL2502424 | 0.77 | TXNRD1 (0.65) | ABCB1MEN1KMT2AAPPMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 311 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117384378-A | Photosensitive polyamic acid ester resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-01-12 | — | — | CN | claimed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-03-05 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-01-01 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| EP-0580108-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-01-26 | — | — | EP | disclosed |
| EP-0560530-A1 | Process for forming negative tone images of polyimides for integrated circuit manufacture | International Business Machines Corporation (US) | 1993-09-15 | — | — | EP | disclosed |
| EP-0538683-A1 | Polyamic acid and polyimide from fluorinated reactant | International Business Machines Corporation (US) | 1993-04-28 | — | — | EP | disclosed |
| EP-0531019-A1 | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES, INC. (JP) | 1993-03-10 | — | — | EP | disclosed |
| EP-0505161-A1 | Photosensitive polymer composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1992-09-23 | — | — | EP | disclosed |
| EP-0355927-A2 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1990-02-28 | — | — | EP | disclosed |
| EP-0203393-B1 | CURABLE COMPOSITION | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1989-07-12 | — | — | EP | disclosed |
| US-4778859-A | Tetramine derived polyimide with pendant unsaturation, and various photosensitive compositions therefrom | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1988-10-18 | — | — | US | disclosed |
| EP-0254230-A2 | Heat-resistant photoresist film | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1988-01-27 | — | — | EP | disclosed |
| EP-0203393-A1 | Curable composition | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1986-12-03 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (7 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | MAOB 4827/4885MAOA 4759/4885ABCB1 2637/4885 |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, SAT1, ASIC1 | MAOB 957/4885MAOA 736/4885ABCB1 2012/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | MAOB 2517/4885MAOA 1350/4885ABCB1 971/4885 |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, ASIC1, SMARCB1 | MAOB 3654/4885MAOA 3545/4885ABCB1 1476/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | MAOB 3218/4885MAOA 2986/4885ABCB1 3868/4885 |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RER1, SEM1, RAD51 | MAOB 3321/4885MAOA 2855/4885ABCB1 2223/4885 |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ARCN1, PBRM1, LCP1 | MAOB 3403/4885MAOA 3659/4885ABCB1 3314/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.