Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 4/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.31 |
| ▸ | NPC1 | O15118 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29184200 | 0.89 | ALDH1A1 (0.36) | HPGDALDH1A1KMT2ASMN1; SMN2 | |
| SCHEMBL29184202 | 0.82 | ALDH1A1 (0.34) | HPGDTSHRALDH1A1KMT2ASMN1; SMN2 | |
| SCHEMBL28058320 | 0.80 | ALDH1A1 (0.32) | HPGDALDH1A1KMT2ASMN1; SMN2NPC1 | |
| SCHEMBL19987653 | 0.76 | L3MBTL1 (0.36) | HPGDTSHRALDH1A1KMT2ASMN1; SMN2 | |
| SCHEMBL1241843 | 0.75 | TSHR (0.41) | HPGDTSHRALDH1A1 | |
| Ether SCHEMBL28240380 | 0.75 | ALDH1A1 (0.37) | HPGDTSHRALDH1A1KMT2ASMN1; SMN2 | |
| SCHEMBL1735137 | 0.73 | TSHR (0.33) | HPGDTSHR | |
| Vinyl Ether SCHEMBL28222295 | 0.71 | L3MBTL1 (0.33) | HPGDTSHRALDH1A1KMT2ASMN1; SMN2 | |
| SCHEMBL28058219 | 0.70 | SMN1; SMN2 (0.39) | ALDH1A1KMT2ASMN1; SMN2RAB9AHSD17B10 | |
| SCHEMBL9746088 | 0.70 | LMNA (0.31) | HPGDSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117832370-A | Laminate for MIP encapsulation, preparation method, encapsulation structure and preparation method | 杭州福斯特电子材料有限公司 | 2024-04-05 | — | — | CN | disclosed |