SCHEMBL29210279

SCHEMBL29210279

Nc1cccc(Oc2ccc(-c3cc(N)ccc3S(N)(=O)=O)cc2)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.50
ALDH1A1 P00352 4/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
MAPT P10636 2/20 0.47
MITF O75030 1/20 0.47
GAA P10253 1/20 0.47
GFER P55789 1/20 0.47
NLRP1 Q9C000 1/20 0.47
NOD2 Q9HC29 1/20 0.47
ATM Q13315 1/20 0.46
LCK P06239 1/20 0.43
KDR P35968 1/20 0.43
TEK Q02763 1/20 0.43
F10 P00742 2/20 0.42
CA12 O43570 2/20 0.41
CA1 P00915 2/20 0.41
CA2 P00918 2/20 0.41
CA9 Q16790 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29210282 0.90 ALDH1A1 (0.45) MAOBALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL7766525 0.81 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL671916 0.80 CA1 (0.50) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL7765529 0.78 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL28928028 0.77 SOS1 (0.68) MAOBALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL30687380 0.77 NPC1 (0.46) ALDH1A1SMN1; SMN2MEN1KMT2ACA12
SCHEMBL8023017 0.77 NPC1 (0.46) ALDH1A1SMN1; SMN2MEN1KMT2ACA12
SCHEMBL261579 0.77 ALDH1A1 (0.73) MAOBALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL8020282 0.77 ALDH1A1 (0.73) MAOBALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL203512 0.77 MAOB (0.76) MAOBALDH1A1SMN1; SMN2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117984624-A High-heat-conductivity metal substrate and preparation method thereof 昆山雅森电子材料科技有限公司 2024-05-07 CN disclosed