SCHEMBL29367715

SCHEMBL29367715

O=C(O)c1cccc(Cc2cccc(C(=O)O)c2C(=O)O)c1C(=O)O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 3/20 0.50
AKR1C3 P42330 2/20 0.48
ALDH1A1 P00352 2/20 0.48
ALOX15 P16050 1/20 0.48
HMGB1 P09429 3/20 0.47
TSHR P16473 2/20 0.47
CLCN2 P51788 1/20 0.43
CA12 O43570 2/20 0.43
CA1 P00915 2/20 0.43
CA2 P00918 2/20 0.43
CA7 P43166 2/20 0.43
CA9 Q16790 2/20 0.43
CA14 Q9ULX7 2/20 0.43
CXCL12 P48061 1/20 0.43
CYP2C9 P11712 1/20 0.42
HIF1A Q16665 1/20 0.42
CDC25B P30305 2/20 0.42
CDC25A P30304 1/20 0.42
HSD17B10 Q99714 1/20 0.42
ATM Q13315 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31090800 1.00 FOLH1 (0.50) FOLH1AKR1C3ALDH1A1ALOX15HMGB1
SCHEMBL23708 1.00 FOLH1 (0.50) FOLH1AKR1C3ALDH1A1ALOX15HMGB1
SCHEMBL5553275 0.98 FOLH1 (0.49) FOLH1AKR1C3ALDH1A1ALOX15HMGB1
SCHEMBL10483666 0.94 TSHR (0.56) FOLH1AKR1C3ALDH1A1ALOX15HMGB1
SCHEMBL8837284 0.89 HSPA5 (0.55) FOLH1AKR1C3ALDH1A1ALOX15HMGB1
SCHEMBL200212 0.88 TSHR (0.59) FOLH1AKR1C3ALDH1A1ALOX15TSHR
SCHEMBL7201768 0.88 HTT (0.53) FOLH1AKR1C3ALDH1A1ALOX15TSHR
SCHEMBL22912 0.87 FOLH1 (0.59) FOLH1AKR1C3ALDH1A1ALOX15HMGB1
SCHEMBL343520 0.87 TSHR (0.57) FOLH1AKR1C3ALDH1A1ALOX15TSHR
SCHEMBL3664355 0.86 TSHR (0.45) FOLH1AKR1C3ALDH1A1ALOX15HMGB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 395 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114929474-B Flexible metal-clad laminate with microstrip line structure 株式会社钟化 2025-01-07 CN claimed
CN-115368608-B Polyimide composite film for flexible metal-clad foil substrate 达迈科技股份有限公司 2024-02-09 CN claimed
CN-117465090-A High-transparency composite PI reinforcing plate and preparation method thereof 昆山雅森电子材料科技有限公司 2024-01-30 CN claimed
CN-110873919-B Optical film 住友化学株式会社 2022-08-19 CN claimed
CN-115122735-B Polyimide, resin composition, resin film, laminate, cover film, resin-coated copper foil, metal-clad laminate, and circuit board NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) 2026-05-26 CN disclosed
CN-117048152-B Method for manufacturing metal-clad laminate NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) 2026-05-26 CN disclosed
CN-115891346-B Metal-clad laminate, circuit board, electronic component, and electronic device 日铁化学材料株式会社 2026-05-15 CN disclosed
CN-122055676-A Resin composition, cured product, display device, or semiconductor device 东丽株式会社 2026-05-15 CN disclosed
CN-122029489-A Photosensitive resin composition, cured product, display device, and electronic component 东丽株式会社 2026-05-12 CN disclosed
CN-120153319-A Photosensitive resin composition, cured product, organic EL display device, electronic component, and semiconductor device 东丽株式会社 2025-06-13 CN disclosed
CN-120143554-A Positive photosensitive resin composition 万华化学集团股份有限公司 2025-06-13 CN disclosed
CN-116075557-B Copper foil with resin layer and laminate using the same 三菱瓦斯化学株式会社 2025-05-27 CN disclosed
CN-114144390-A Graphite sheet and electronic device comprising same 聚酰亚胺先端材料有限公司 2022-03-04 CN disclosed
CN-106715597-B Resin composition, method for producing heat-resistant resin film, and display device 东丽株式会社 2022-03-01 CN disclosed
CN-109426071-B Blue photosensitive resin composition, color filter and image display device 东友精细化工有限公司 2022-02-25 CN disclosed
CN-109239816-B Laminated film, and display device including the same 三星电子株式会社 2022-02-25 CN disclosed
CN-108475023-B Photosensitive resin composition, dry film, cured product and printed wiring board 太阳控股株式会社 2022-02-25 CN disclosed
CN-114058324-A Thermosetting resin composition and use thereof 东洋油墨SC控股株式会社 2022-02-18 CN disclosed
WO-2022032306-A1 PROCESS FOR POLYIMIDE SYNTHESIS AND POLYIMIDES MADE THEREFROM ZYMERGEN INC. (US) 2022-02-10 WO disclosed
CN-114008139-A Resin composition, method for producing resin composition, and insulated wire 住友电气工业株式会社 2022-02-01 CN disclosed