Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.39 |
| ▸ | ALOX15 | P16050 | 5/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | ESR1 | P03372 | 2/20 | 0.39 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.39 |
| ▸ | MIF | P14174 | 1/20 | 0.39 |
| ▸ | TYR | P14679 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.37 |
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | ATP2A2 | P16615 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL36382 | 1.00 | ALDH1A1 (0.39) | ALDH1A1ALOX15HSD17B10LMNAESR1 | |
| SCHEMBL6751257 | 0.88 | ESR1 (0.46) | ALDH1A1ALOX15HSD17B10LMNAESR1 | |
| SCHEMBL9752056 | 0.87 | ALDH1A1 (0.54) | ALDH1A1ALOX15HSD17B10LMNAESR1 | |
| SCHEMBL8977700 | 0.87 | ALDH1A1 (0.43) | ALDH1A1ALOX15HSD17B10LMNAESR1 | |
| SCHEMBL8644897 | 0.85 | ALDH1A1 (0.48) | ALDH1A1ALOX15HSD17B10LMNAESR1 | |
| SCHEMBL8977698 | 0.85 | ALDH1A1 (0.48) | ALDH1A1ALOX15HSD17B10LMNAESR1 | |
| SCHEMBL29488108 | 0.84 | CA2 (0.56) | ALDH1A1ALOX15HSD17B10LMNANR1I2 | |
| SCHEMBL3169896 | 0.84 | CA2 (0.56) | ALDH1A1ALOX15HSD17B10LMNANR1I2 | |
| SCHEMBL29375143 | 0.83 | ESR1 (0.58) | ALDH1A1ALOX15HSD17B10LMNAESR1 | |
| SCHEMBL759290 | 0.83 | ESR1 (0.58) | ALDH1A1ALOX15HSD17B10LMNAESR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122043858-A | EUV patterned resist formation method | 亚历克斯·P·G·罗宾逊 | 2026-05-15 | — | — | CN | disclosed |
| EP-4737506-A1 | CURED FILM AND ORGANIC EL DISPLAY DEVICE | Toray Industries, Inc. (JP) | 2026-05-06 | — | — | EP | disclosed |
| EP-4702010-A1 | PHOTOACTIVE COMPOUNDS | Merck Patent GmbH (DE) | 2026-03-04 | — | — | EP | disclosed |
| CN-120077104-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-30 | — | — | CN | disclosed |
| US-20250172873-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED ARTICLE, METHOD FOR MANUFACTURING CURED ARTICLE, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2025-05-29 | — | — | US | disclosed |
| CN-119998728-A | Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate | 富士胶片株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119968421-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-119731595-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| CN-119731225-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| CN-119620544-A | Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| CN-107561863-B | Positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2022-09-16 | — | — | CN | disclosed |
| CN-114902135-A | Positive photosensitive resin composition, cured film and resist film | DIC株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-107870516-B | Positive photosensitive resin composition, patterned film and method for manufacturing bump | 奇美实业股份有限公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-114326300-A | Positive photoresist composition, preparation method and photoresist pattern forming method | 上海飞凯材料科技股份有限公司 | 2022-04-12 | — | — | CN | disclosed |
| WO-2022065041-A1 | RESIN CONTAINING PHENOLIC HYDROXYL GROUP, RESIN COMPOSITION FOR ALKALI-DEVELOPABLE RESISTS, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN CONTAINING PHENOLIC HYDROXYL GROUP | DIC株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022059448-A1 | METHOD FOR PRODUCING RESIST PATTERN, RESIST PATTERN AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCTION OF TRANSPARENT MULTILAYER MEMBER | DIC株式会社 | 2022-03-24 | — | — | WO | disclosed |
| CN-114207038-A | Resin composition, method for producing cured product, patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2022-03-18 | — | — | CN | disclosed |
| CN-107703685-B | Laminate and method for producing laminate | 东京应化工业株式会社 | 2022-03-18 | — | — | CN | disclosed |
| CN-107179652-B | Positive photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2022-02-08 | — | — | CN | disclosed |
| CN-113994256-A | Method for forming EUV patterned resist | 亚历克斯·P·G·罗宾逊 | 2022-01-28 | — | — | CN | disclosed |