SCHEMBL759290

SCHEMBL759290

CC(C)(c1ccc(O)cc1)c1ccc(O)c(O)c1O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 10/20 0.58
ESR2 Q92731 7/20 0.58
HSD17B10 Q99714 3/20 0.58
CYP3A4 P08684 2/20 0.58
HPGD P15428 2/20 0.58
AR P10275 1/20 0.58
TSHR P16473 1/20 0.58
SLC6A2 P23975 1/20 0.58
SLC6A4 P31645 1/20 0.58
HTR6 P50406 1/20 0.58
ESRRG P62508 1/20 0.58
SLC6A3 Q01959 1/20 0.58
ALDH1A1 P00352 3/20 0.50
LMNA P02545 2/20 0.46
TYR P14679 2/20 0.46
ALOX15 P16050 3/20 0.41
NR1I2 O75469 1/20 0.41
CYP2C9 P11712 1/20 0.41
MIF P14174 1/20 0.41
HTT P42858 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29375143 1.00 ESR1 (0.58) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL6751257 0.94 ESR1 (0.46) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL9846448 0.87 ESR1 (0.57) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL13589380 0.85 ESR1 (0.54) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL4055015 0.85 ESR1 (0.54) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL29370295 0.83 ALDH1A1 (0.39) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL36382 0.83 ALDH1A1 (0.39) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL28649969 0.79 ESR1 (0.62) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL6157236 0.79 ESR1 (0.62) ESR1ESR2HSD17B10CYP3A4HPGD
SCHEMBL759916 0.78 ESR1 (0.48) ESR1ESR2HSD17B10CYP3A4HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 190 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113620786-A Method for synthesizing polyhydroxy phenolic compound by acid method 辽宁靖帆新材料有限公司 2021-11-09 CN claimed
CN-113443969-A Method for preparing 4- [1- (4-hydroxyphenyl) -1-methyl-ethyl ] pyrogallol by resin method 辽宁靖帆新材料有限公司 2021-09-28 CN claimed
EP-0587942-A1 Heat-resistant and flame-retardant or flameproof PUR hot melt adhesive H.B. FULLER LICENSING & FINANCING, INC. (US) 1994-03-23 EP claimed
WO-2025105140-A1 COMPOUND, POLYMER, RESIST COMPOSITION, RESIST FILM, AND OPTICAL ELEMENT AGC株式会社 2025-05-22 WO disclosed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
WO-2025013535-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PARTITION WALL, AND OPTICAL ELEMENT AGC株式会社 2025-01-16 WO disclosed
EP-3224326-B1 COATING COMPOSITION COMPRISING A BINDER FORMED FROM POLYESTER AND A PHOSPHORUS ACID PPG IND OHIO INC (US) 2024-10-16 EP disclosed
WO-2024135575-A1 PHOTOSENSITIVE RESIN COMPOSITION, PARTITION WALL, AND OPTICAL ELEMENT AGC株式会社 2024-06-27 WO disclosed
WO-2024038814-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PARTITION WALL, AND OPTICAL ELEMENT AGC株式会社 2024-02-22 WO disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
US-11739215-B2 Photosensitive resin composition ZEON CORPORATION (JP) 2023-08-29 US disclosed
WO-2005007719-A2 POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2005-01-27 WO disclosed
CN-1550898-A Positive anticorrosive additive composition and anticorrosive pattern forming method 东京应化工业株式会社 2004-12-01 CN disclosed
US-20040081909-A1 Novolak resin solution, positive photoresist composition and preparation method thereof TOKYO OHKA KOGYO CO., LTD. (JP) 2004-04-29 US disclosed
CN-1484095-A Positive photoresist composition and method for forming slushing pattern 东京应化工业株式会社 2004-03-24 CN disclosed
CN-1469197-A Positive photoresist composition and method for forming resist pattern 东京应化工业株式会社 2004-01-21 CN disclosed
CN-1469199-A Positive photoresist composition and method for forming etch resistant pattern 东京应化工业株式会社 2004-01-21 CN disclosed
CN-1453639-A Novolac resin solution photoresist composition and its preparing method TOKYO IND CO LTD (JP) 2003-11-05 CN disclosed
EP-0587942-A1 Heat-resistant and flame-retardant or flameproof PUR hot melt adhesive H.B. FULLER LICENSING & FINANCING, INC. (US) 1994-03-23 EP disclosed
EP-0587942-A1 Heat-resistant and flame-retardant or flameproof PUR hot melt adhesive H.B. FULLER LICENSING & FINANCING, INC. (US) 1994-03-23 EP disclosed