Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TEK | Q02763 | 1/20 | 0.50 |
| ▸ | AMY1A | P0DUB6 | 3/20 | 0.49 |
| ▸ | PIM1 | P11309 | 1/20 | 0.48 |
| ▸ | CSNK2A2 | P19784 | 1/20 | 0.48 |
| ▸ | CSNK2B | P67870 | 1/20 | 0.48 |
| ▸ | PIM3 | Q86V86 | 1/20 | 0.48 |
| ▸ | PIM2 | Q9P1W9 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.48 |
| ▸ | NPC1 | O15118 | 1/20 | 0.48 |
| ▸ | RAB9A | P51151 | 1/20 | 0.48 |
| ▸ | GPR55 | Q9Y2T6 | 1/20 | 0.48 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.47 |
| ▸ | PDE5A | O76074 | 4/20 | 0.47 |
| ▸ | AURKA | O14965 | 1/20 | 0.47 |
| ▸ | MAPK13 | O15264 | 1/20 | 0.46 |
| ▸ | RAF1 | P04049 | 1/20 | 0.46 |
| ▸ | MAPK12 | P53778 | 1/20 | 0.46 |
| ▸ | MAPK11 | Q15759 | 1/20 | 0.46 |
| ▸ | MAPK14 | Q16539 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3194043 | 1.00 | TEK (0.50) | TEKAMY1APIM1CSNK2A2CSNK2B | |
| SCHEMBL6673971 | 0.87 | AMY1A (0.48) | TEKAMY1APIM1CSNK2A2CSNK2B | |
| SCHEMBL25772952 | 0.82 | PDE5A (0.55) | AMY1AALDH1A1KDM4ERAB9AALOX5 | |
| SCHEMBL10600871 | 0.81 | MAPK14 (0.59) | TEKALDH1A1KDM4ENPC1RAB9A | |
| SCHEMBL5076359 | 0.81 | TEK (0.57) | TEKALDH1A1KDM4ENPC1RAB9A | |
| SCHEMBL29895756 | 0.80 | TEK (0.59) | TEKALDH1A1KDM4ENPC1RAB9A | |
| SCHEMBL29581646 | 0.80 | TEK (0.59) | TEKALDH1A1KDM4ENPC1RAB9A | |
| SCHEMBL9496039 | 0.80 | TEK (0.59) | TEKALDH1A1KDM4ENPC1RAB9A | |
| SCHEMBL30641654 | 0.79 | MEN1 (0.58) | ALDH1A1KDM4EGPR55PDE5AAURKA | |
| SCHEMBL28004199 | 0.79 | TEK (0.64) | TEKALDH1A1KDM4ENPC1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 281 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120122391-A | Photosensitive resin composition containing photobleachable aminomethylanthracene photosensitizer and application thereof | 湖南初源新材料股份有限公司 | 2025-06-10 | — | — | CN | claimed |
| CN-120065628-A | Photosensitive resin composition containing photobleachable dienyl anthracene photosensitizer and application thereof | 湖南初源新材料股份有限公司 | 2025-05-30 | — | — | CN | claimed |
| CN-120040387-A | Diepoxyalkoxyl anthracene photosensitizer, photo-curing resin composition, photosensitive dry film and application | 湖南初源新材料股份有限公司 | 2025-05-27 | — | — | CN | claimed |
| CN-119937245-A | Photosensitive resin composition, photosensitive cover film and electronic component | 杭州福斯特电子材料有限公司 | 2025-05-06 | — | — | CN | claimed |
| CN-119916644-A | Photosensitive resin composition containing alkynyl anthracene photosensitizer and application thereof | 湖南初源新材料股份有限公司 | 2025-05-02 | — | — | CN | claimed |
| CN-114755889-B | Dry film resist and photosensitive dry film | 杭州福斯特电子材料有限公司 | 2024-12-31 | — | — | CN | claimed |
| CN-119148465-A | Photosensitive resin composition, photosensitive dry film and application thereof | 杭州福斯特电子材料有限公司 | 2024-12-17 | — | — | CN | claimed |
| CN-118393813-B | Dry film for electroplated copper column and IC carrier copper column | 湖南初源新材料股份有限公司 | 2024-11-05 | — | — | CN | claimed |
| CN-118871861-A | Dry film resist, photosensitive dry film and copper-clad plate | 杭州福斯特电子材料有限公司 | 2024-10-29 | — | — | CN | claimed |
| CN-118625599-A | Photosensitive resin composition, photosensitive dry film and preparation method thereof | 杭州福斯特电子材料有限公司 | 2024-09-10 | — | — | CN | claimed |
| CN-116184763-A | Photocurable resin composition and application thereof | 杭州福斯特电子材料有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-110471256-B | Photosensitive resin composition | 杭州福斯特电子材料有限公司 | 2023-05-12 | — | — | CN | claimed |
| CN-113801291-B | Photosensitive resin composition, photosensitive dry film resist and manufacturing method of PCB | 杭州福斯特电子材料有限公司 | 2023-05-12 | — | — | CN | claimed |
| CN-114716628-B | LDI photosensitive dry film and preparation method thereof | 广东诚展科技股份有限公司 | 2022-09-20 | — | — | CN | claimed |
| CN-114755889-A | Dry film resist and photosensitive dry film | 杭州福斯特电子材料有限公司 | 2022-07-15 | — | — | CN | claimed |
| CN-114716628-A | LDI photosensitive dry film and preparation method thereof | 河源诚展科技有限公司 | 2022-07-08 | — | — | CN | claimed |
| CN-114660895-A | Dry film resist, photosensitive dry film and copper-clad plate | 杭州福斯特电子材料有限公司 | 2022-06-24 | — | — | CN | claimed |
| CN-109828436-B | High-adhesion etching-resistant photosensitive resin composition | 杭州福斯特电子材料有限公司 | 2022-05-31 | — | — | CN | claimed |
| CN-113174040-B | Photopolymerizable monomer and high-resolution high-adhesion LDI dry film resist composed of photopolymerizable monomer | 杭州福斯特电子材料有限公司 | 2022-05-17 | — | — | CN | claimed |
| CN-110488570-B | Photosensitive resin composition and application thereof | 浙江福斯特新材料研究院有限公司 | 2022-03-11 | — | — | CN | claimed |