SCHEMBL29404149

SCHEMBL29404149

O=C(O)c1ccc(Oc2cccc(C(=O)O)c2C(=O)O)cc1C(=O)O

nearest known ligand 0.53

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
PYGL P06737 11/20 0.53
POLB P06746 2/20 0.53
HPSE Q9Y251 1/20 0.52
KDM4E B2RXH2 1/20 0.51
PYGM P11217 11/20 0.50
ALDH1A1 P00352 1/20 0.47
GALK1 P51570 1/20 0.47
CASP6 P55212 1/20 0.47
MCL1 Q07820 1/20 0.47
PLEC Q15149 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
CDC25A P30304 1/20 0.45
CDC25B P30305 1/20 0.45
HSD17B10 Q99714 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL716921 1.00 PYGL (0.53) PYGLPOLBHPSEKDM4EPYGM
SCHEMBL422032 0.97 POLB (0.57) PYGLPOLBHPSEKDM4EPYGM
SCHEMBL3417323 0.93 TDP1 (0.54) PYGLPOLBHPSEKDM4EPYGM
SCHEMBL425842 0.90 POLB (0.70) PYGLPOLBHPSEKDM4EPYGM
SCHEMBL420308 0.89 POLB (0.50) PYGLPOLBHPSEKDM4EPYGM
SCHEMBL426354 0.88 KDM4E (0.55) PYGLPOLBHPSEKDM4EPYGM
SCHEMBL31105217 0.88 CTNNB1 (0.50) POLBHPSEKDM4EALDH1A1TDP1
SCHEMBL261107 0.88 CTNNB1 (0.50) POLBHPSEKDM4EALDH1A1TDP1
SCHEMBL421351 0.88 POLB (0.59) PYGLPOLBHPSEKDM4EPYGM
SCHEMBL1044631 0.87 HPSE (0.48) PYGLPOLBHPSEKDM4EPYGM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110172050-B Purification of oxydiphthalic anhydride 高新特殊工程塑料全球技术有限公司 2024-03-12 CN claimed
CN-120059184-A Polyimide precursor composition, polyimide film, and polyimide film/substrate laminate UBE株式会社 2025-05-30 CN disclosed
CN-118139913-B Polyimide precursor composition, polyimide film, and polyimide film/substrate laminate UBE株式会社 2025-04-29 CN disclosed
CN-119654696-A Method for manufacturing substrate laminate and semiconductor device 三井化学株式会社 2025-03-18 CN disclosed
CN-119497906-A Method for producing substrate laminate and substrate laminate 三井化学株式会社 2025-02-21 CN disclosed
CN-115697575-B Resin film and method for producing same 东洋纺株式会社 2025-01-14 CN disclosed
CN-119173585-A Polyimide precursor composition, polyimide film, and polyimide film/substrate laminate UBE株式会社 2024-12-20 CN disclosed
CN-115956098-B Composition, laminate, and method for producing laminate 三井化学株式会社 2024-11-26 CN disclosed
CN-118139913-A Polyimide precursor composition, polyimide film, and polyimide film/substrate laminate UBE株式会社 2024-06-04 CN disclosed
CN-117941037-A Composition for forming film for semiconductor, laminate, and substrate laminate 三井化学株式会社 2024-04-26 CN disclosed
WO-2024029390-A1 METHOD FOR PRODUCING SUBSTRATE LAMINATE AND SEMICONDUCTOR DEVICE 三井化学株式会社 2024-02-08 WO disclosed
CN-117070147-A Composition for producing film for semiconductor device and method for producing same 三井化学株式会社 2023-11-17 CN disclosed
CN-116940420-A Method for producing resin film and film before cutting 东洋纺株式会社 2023-10-24 CN disclosed
CN-108352320-B Film composition for semiconductor, method for producing same, and semiconductor device 三井化学株式会社 2023-09-08 CN disclosed
CN-115956098-A Composition, laminate, and method for producing laminate 三井化学株式会社 2023-04-11 CN disclosed
CN-115697575-A Resin film and method for producing same 东洋纺株式会社 2023-02-03 CN disclosed
CN-115461207-A Method for producing resin film and precut film 东洋纺株式会社 2022-12-09 CN disclosed
CN-115427229-A Laminate comprising transparent highly heat-resistant film 东洋纺株式会社 2022-12-02 CN disclosed
CN-110545997-B Substrate laminate and method for manufacturing substrate laminate 三井化学株式会社 2022-05-24 CN disclosed
WO-2022054839-A1 COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY 三井化学株式会社 2022-03-17 WO disclosed