SCHEMBL29434205

SCHEMBL29434205

C=Cc1cccc(-c2ccccc2CC)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
TRPA1 O75762 1/20 0.42
PTGS2 P35354 1/20 0.42
PTPN5 P54829 1/20 0.40
PTGER1 P34995 1/20 0.40
PTGER4 P35408 1/20 0.40
PTGER3 P43115 1/20 0.40
PTGER2 P43116 1/20 0.40
GRM5 P41594 1/20 0.39
ALDH1A1 P00352 1/20 0.38
TSHR P16473 1/20 0.38
ALOX5AP P20292 1/20 0.37
FEN1 P39748 1/20 0.37
FFAR1 O14842 1/20 0.36
FFAR4 Q5NUL3 1/20 0.36
CSNK2A2 P19784 1/20 0.36
CSNK2B P67870 1/20 0.36
CSNK2A1 P68400 1/20 0.36
CSNK2A3 Q8NEV1 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4520753 1.00 TP53 (0.43) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL21380067 0.89 TP53 (0.42) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL5036786 0.87 PTGER4 (0.41) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL29434175 0.87 PTGER4 (0.41) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL21380063 0.87 TP53 (0.43) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL6423019 0.85 TRPA1 (0.43) TRPA1PTPN5PTGER1PTGER4PTGER3
SCHEMBL11647426 0.82 PTGER1 (0.53) TRPA1PTPN5PTGER1PTGER4PTGER3
SCHEMBL4513000 0.81 TRPA1 (0.42) TRPA1ALDH1A1TSHRALOX5APFEN1
SCHEMBL5878687 0.78 ALDH1A1 (0.52) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL27668696 0.78 ALDH1A1 (0.39) TP53TDP1PTGS2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117720787-A Flexible metal clad laminate and method of making the same 科腾聚合物荷兰有限责任公司 2024-03-19 CN disclosed
CN-112368311-B Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2023-11-03 CN disclosed
CN-112020523-B Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2023-10-24 CN disclosed
CN-116056885-A Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2023-05-02 CN disclosed
CN-111620982-B Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same 南亚新材料科技股份有限公司 2023-02-10 CN disclosed
CN-114555360-A Copper-clad laminate, wiring board, and resin-attached copper foil 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114555357-A Metal-clad laminate, wiring board, metal foil with resin, and resin composition 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114423602-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-04-29 CN disclosed
CN-114174411-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-03-11 CN disclosed