SCHEMBL4520753

SCHEMBL4520753

C=Cc1cccc(-c2ccccc2CC)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
TRPA1 O75762 1/20 0.42
PTGS2 P35354 1/20 0.42
PTPN5 P54829 1/20 0.40
PTGER1 P34995 1/20 0.40
PTGER4 P35408 1/20 0.40
PTGER3 P43115 1/20 0.40
PTGER2 P43116 1/20 0.40
GRM5 P41594 1/20 0.39
ALDH1A1 P00352 1/20 0.38
TSHR P16473 1/20 0.38
ALOX5AP P20292 1/20 0.37
FEN1 P39748 1/20 0.37
FFAR1 O14842 1/20 0.36
FFAR4 Q5NUL3 1/20 0.36
CSNK2A2 P19784 1/20 0.36
CSNK2B P67870 1/20 0.36
CSNK2A1 P68400 1/20 0.36
CSNK2A3 Q8NEV1 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29434205 1.00 TP53 (0.43) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL21380067 0.89 TP53 (0.42) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL5036786 0.87 PTGER4 (0.41) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL29434175 0.87 PTGER4 (0.41) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL21380063 0.87 TP53 (0.43) TP53TDP1TRPA1PTGS2PTPN5
SCHEMBL6423019 0.85 TRPA1 (0.43) TRPA1PTPN5PTGER1PTGER4PTGER3
SCHEMBL11647426 0.82 PTGER1 (0.53) TRPA1PTPN5PTGER1PTGER4PTGER3
SCHEMBL4513000 0.81 TRPA1 (0.42) TRPA1ALDH1A1TSHRALOX5APFEN1
SCHEMBL5878687 0.78 ALDH1A1 (0.52) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL27668696 0.78 ALDH1A1 (0.39) TP53TDP1PTGS2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF Kraton Corporation (US) 2026-02-05 US disclosed
US-20250367910-A1 LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES NOTARK CORPORATION (US) 2025-12-04 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-12022611-B2 Prepreg, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-25 US disclosed
EP-3663352-A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED LAMINATE MADE USING SAME Shengyi Technology Co., Ltd. (CN) 2020-06-10 EP disclosed
US-20200157261-A1 THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LAMINATE PREPARED FROM SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2020-05-21 US disclosed
US-20200157332-A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED LAMINATE MADE USING SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2020-05-21 US disclosed
WO-2020017399-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-01-23 WO disclosed
CN-109385020-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
CN-109385018-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
US-7595362-B2 Curable resin composition NIPPON STEEL CHEMICAL CO., LTD. (JP) 2009-09-29 US disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed
US-20070129502-A1 Polyphenylene ethers; improved chemical resistance, dielectric, low water-absorption, heat resistance, flame retardance, and mechanical properties; laminates NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-06-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF VCL, FGB, CDH1 TP53 3478/4885TDP1 1777/4885TRPA1 2489/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 TP53 3368/4885TDP1 1275/4885TRPA1 1271/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD TP53 3077/4885TDP1 1794/4885TRPA1 395/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.