SCHEMBL29436304

SCHEMBL29436304

CC(Cc1ccc(Oc2cccc(N)c2)cc1)c1ccc(Oc2cccc(N)c2)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 2/20 0.54
ALDH1A1 P00352 4/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
MAPT P10636 2/20 0.47
MEN1 O00255 1/20 0.47
MITF O75030 1/20 0.47
GAA P10253 1/20 0.47
GFER P55789 1/20 0.47
KMT2A Q03164 1/20 0.47
NLRP1 Q9C000 1/20 0.47
NOD2 Q9HC29 1/20 0.47
ESR1 P03372 1/20 0.45
ESR2 Q92731 1/20 0.45
LTA4H P09960 1/20 0.44
CYP3A4 P08684 2/20 0.44
TP53 P04637 1/20 0.44
ATM Q13315 1/20 0.42
POLB P06746 1/20 0.41
HSP90AA1 P07900 1/20 0.41
APP P05067 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7865335 1.00 MAOB (0.54) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL7866770 0.87 MAOB (0.50) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL8961351 0.86 MAOB (0.46) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL1856444 0.85 ESR1 (0.52) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL29263288 0.85 ESR1 (0.52) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL2787079 0.84 MAOB (0.50) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL2785194 0.84 ALDH1A1 (0.54) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL16678937 0.84 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL10476052 0.84 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL309289 0.82 MAOB (0.63) MAOBALDH1A1SMN1; SMN2MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114174422-A Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board DIC株式会社 2022-03-11 CN disclosed