SCHEMBL7865335

SCHEMBL7865335

CC(Cc1ccc(Oc2cccc(N)c2)cc1)c1ccc(Oc2cccc(N)c2)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 2/20 0.54
ALDH1A1 P00352 4/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
MAPT P10636 2/20 0.47
MEN1 O00255 1/20 0.47
MITF O75030 1/20 0.47
GAA P10253 1/20 0.47
GFER P55789 1/20 0.47
KMT2A Q03164 1/20 0.47
NLRP1 Q9C000 1/20 0.47
NOD2 Q9HC29 1/20 0.47
ESR1 P03372 1/20 0.45
ESR2 Q92731 1/20 0.45
LTA4H P09960 1/20 0.44
CYP3A4 P08684 2/20 0.44
TP53 P04637 1/20 0.44
ATM Q13315 1/20 0.42
POLB P06746 1/20 0.41
HSP90AA1 P07900 1/20 0.41
APP P05067 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29436304 1.00 MAOB (0.54) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL7866770 0.87 MAOB (0.50) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL8961351 0.86 MAOB (0.46) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL1856444 0.85 ESR1 (0.52) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL29263288 0.85 ESR1 (0.52) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL2787079 0.84 MAOB (0.50) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL2785194 0.84 ALDH1A1 (0.54) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL16678937 0.84 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL10476052 0.84 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL309289 0.82 MAOB (0.63) MAOBALDH1A1SMN1; SMN2MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117659932-A Polyamide-imide resin adhesive, preparation method thereof and temporary adhesive film for packaging semiconductor element 芜湖徽氏新材料科技有限公司 2024-03-08 CN disclosed
US-9735429-B2 Lithium ion secondary battery HITACHI, LTD. (JP) 2017-08-15 US disclosed
EP-2858150-B1 LITHIUM ION SECONDARY BATTERY HITACHI LTD (JP) 2017-03-15 EP disclosed
US-20150155563-A1 LITHIUM ION SECONDARY BATTERY HITACHI, LTD., (JP) 2015-06-04 US disclosed
EP-2858150-A1 LITHIUM ION SECONDARY BATTERY Hitachi, Ltd. (JP) 2015-04-08 EP disclosed
US-6307008-B1 CYCLIC TETRAACIDS WITH AROMATIC DIAMINES AS ADHESIVES FOR SEMICONDUCTORS AND ADHESIVES SAEHAN INDUSTRIES CORPORATION (KR) 2001-10-23 US disclosed
EP-0661347-B1 Polyimide resin composition having excellent fatigue resistance and injection molded article of same MITSUI CHEMICALS INC (JP) 2000-03-08 EP disclosed
EP-0564299-B1 Use of liquid cristalline polyimides in thermoplastic compositions MITSUI CHEMICALS INC (JP) 1999-11-03 EP disclosed
EP-0605112-B1 Use of an insulating adhesive tape, lead frame and semiconductor device employing the tape MITSUI CHEMICALS INC (JP) 1999-03-17 EP disclosed
EP-0518543-B1 Polyimide and process for the preparation thereof MITSUI TOATSU CHEMICALS (JP) 1997-03-12 EP disclosed
US-5506291-A FORMED BY REACTING ONE OR MORE DIAMINES WITH PYROMLLITIC ACID OR BIPHENYLTETRACARBOXYLIC ACID/3,3',4,4'-/ AND ENDCAPPED BY ANHYDRIDE OR AROMATIC MONOAMINE; USED FOR ELECTRONICS, AIRCRAFT, AND ELECTRICAL APPLIANCES MITSUI TOATSU CHEMICALS, INC. (JP) 1996-04-09 US disclosed
EP-0661347-A1 Polyimide resin composition having excellent fatigue resistance and injection molded article of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-07-05 EP disclosed
US-5406124-A Thermoplastic polyimides MITSUI TOATSU CHEMICALS, INC. (JP) 1995-04-11 US disclosed
US-5380805-A Polyamideimide copolymers for heat resistance and high temperature engineering polymers MITSUI TOATSU CHEMICALS, INC. (JP) 1995-01-10 US disclosed
US-5354890-A Aromatic diamine intermediates useful in the preparation of polyimides MITSUI TOATSU CHEMICALS, INC. (JP) 1994-10-11 US disclosed
EP-0605112-A2 Insulating adhesive tape, and lead frame and semiconductor device employing the tape MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-07-06 EP disclosed
US-5321096-A Good processability and heat stability MITSUI TOATSU CHEMICAL, INCORPORATED (JP) 1994-06-14 US disclosed
US-5260388-A Reacting aromatic diamine with tetracarboxylic anhydride in presence of aromatic dicarboxylic anhydride or monoamine, imidizing; low dielectric characteristics; electronics MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1993-11-09 US disclosed
EP-0564299-A2 Polyimide composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-06 EP disclosed
EP-0518543-A2 Polyimide and process for the preparation thereof MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-12-16 EP disclosed