SCHEMBL29449252

SCHEMBL29449252

N[Si](N)(N)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29449260 1.00 LMNA (0.31) LMNA
SCHEMBL242531 1.00 LMNA (0.31) LMNA
SCHEMBL7518737 1.00 LMNA (0.31) LMNA
SCHEMBL29449245 0.98
SCHEMBL29449263 0.90
SCHEMBL29449242 0.82
SCHEMBL29449251 0.82
SCHEMBL29449250 0.82
SCHEMBL29449248 0.82
SCHEMBL12050425 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD CENTRAL GLASS CO LTD (JP) 2026-01-15 US disclosed
US-20250343040-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD CENTRAL GLASS CO LTD (JP) 2025-11-06 US disclosed
EP-4535406-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD Central Glass Company, Limited (JP) 2025-04-09 EP disclosed
EP-4535405-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD Central Glass Company, Limited (JP) 2025-04-09 EP disclosed
CN-113169060-B Chamfering part treating agent composition and method for manufacturing wafer 中央硝子株式会社 2025-04-01 CN disclosed
US-20250066621-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR MANUFACTURING SUBSTRATE CENTRAL GLASS COMPANY, LIMITED (JP) 2025-02-27 US disclosed
CN-119278503-A Substrate processing method and substrate manufacturing method 中央硝子株式会社 2025-01-07 CN disclosed
CN-119278504-A Substrate processing method and substrate manufacturing method 中央硝子株式会社 2025-01-07 CN disclosed
WO-2024248021-A1 FILM-FORMING COMPOSITION, METHOD FOR PRODUCING SUBSTRATE, AND METHOD FOR PRODUCING FILM-FORMING COMPOSITION セントラル硝子株式会社 2024-12-05 WO disclosed
EP-4459666-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR PRODUCING SUBSTRATE Central Glass Company, Limited (JP) 2024-11-06 EP disclosed
WO-2024143097-A1 SUBSTRATE TREATING METHOD AND SUBSTRATE MANUFACTURING METHOD セントラル硝子株式会社 2024-07-04 WO disclosed
WO-2023234370-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD セントラル硝子株式会社 2023-12-07 WO disclosed
WO-2023234368-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD セントラル硝子株式会社 2023-12-07 WO disclosed
US-11817310-B2 Bevel portion treatment agent composition and method of manufacturing wafer CENTRAL GLASS COMPANY, LIMITED (JP) 2023-11-14 US disclosed
US-20230282473-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-07 US disclosed
US-20230282474-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-07 US disclosed
WO-2023127942-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR PRODUCING SUBSTRATE セントラル硝子株式会社 2023-07-06 WO disclosed
EP-4155375-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP disclosed
EP-4155376-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATE, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP disclosed
US-11282709-B2 Chemical agent for forming water repellent protective film and surface treatment method for wafers CENTRAL GLASS COMPANY, LIMITED (JP) 2022-03-22 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11817310-B2 Bevel portion treatment agent composition and method of manufacturing wafer SGMS1, SGMS2, SEM1 LMNA 234/4885
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD ESPL1, SMS, SGMS1 LMNA 115/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.