SCHEMBL29488303

SCHEMBL29488303

Nc1ccc(Oc2ccc(C3=CCC(N)(Oc4ccc(N)cc4)C=C3)cc2)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.41
TDP1 Q9NUW8 2/20 0.41
CYP3A4 P08684 1/20 0.41
TSHR P16473 1/20 0.41
MAOA P21397 2/20 0.37
MAPT P10636 5/20 0.36
TEAD4 Q15561 1/20 0.36
MAOB P27338 1/20 0.36
SMN1; SMN2 Q16637 3/20 0.35
MEN1 O00255 3/20 0.35
KMT2A Q03164 3/20 0.35
POLB P06746 1/20 0.35
MITF O75030 1/20 0.35
GAA P10253 1/20 0.35
GFER P55789 1/20 0.35
NLRP1 Q9C000 1/20 0.35
NOD2 Q9HC29 1/20 0.35
NPC1 O15118 3/20 0.33
RAB9A P51151 3/20 0.33
MAPK1 P28482 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30089441 0.78 TDP1 (0.32) ALDH1A1TDP1CYP3A4MAPK1
SCHEMBL2403790 0.77 CYP3A4 (0.40) ALDH1A1TDP1CYP3A4MAPTSMN1; SMN2
SCHEMBL31344012 0.77 ALDH1A1 (0.36) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL27519669 0.75 TSHR (0.33) TDP1TSHRMAPT
SCHEMBL30066040 0.74 CYP3A4 (0.33) TDP1CYP3A4
SCHEMBL1119476 0.73 MAOA (0.37) ALDH1A1TDP1CYP3A4MAOAMAPT
SCHEMBL6750487 0.73 MAOA (0.45) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL28359754 0.72 CYP19A1 (0.33) ALDH1A1
SCHEMBL31344009 0.71 NCOA1 (0.35) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL21753771 0.70 RAB9A (0.41) TDP1MAOAMAPTMAOBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110734736-B Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same 东丽株式会社 2022-04-19 CN disclosed