Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | G6PD | P11413 | 1/20 | 0.36 |
| ▸ | CASP7 | P55210 | 1/20 | 0.36 |
| ▸ | CASP6 | P55212 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4247533 | 0.79 | ALDH1A1 (0.30) | HIF1AALDH1A1TP53CYP3A4TSHR | |
| SCHEMBL29398692 | 0.77 | TSHR (0.35) | HIF1AALDH1A1TP53CYP3A4TSHR | |
| SCHEMBL28732999 | 0.71 | ADRA2A (0.33) | — | |
| SCHEMBL4271405 | 0.71 | G6PD (0.35) | G6PDCASP7CASP6HIF1AKDM4E | |
| SCHEMBL1487504 | 0.71 | — | — | |
| SCHEMBL7721987 | 0.70 | TSHR (0.47) | HIF1ATDP1ALDH1A1TP53TSHR | |
| Water SCHEMBL28325021 | 0.70 | G6PD (0.34) | G6PDCASP7CASP6HIF1AKDM4E | |
| SCHEMBL5468903 | 0.68 | TDP1 (0.34) | HIF1ATDP1ALDH1A1TP53CYP3A4 | |
| SCHEMBL3415653 | 0.68 | ALDH1A1 (0.36) | HIF1AALDH1A1TP53CYP3A4TSHR | |
| SCHEMBL31619901 | 0.67 | ALDH1A1 (0.37) | HIF1AALDH1A1TP53CYP3A4TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120137142-A | Intrinsic flame-retardant/antibacterial organic phosphine modified unsaturated resin and preparation method thereof | 浙江工业大学 | 2025-06-13 | — | — | CN | claimed |
| WO-2023168833-A1 | COMPOSITION, ADHESIVE FILM AND CHIP PACKAGING STRUCTURE | 武汉市三选科技有限公司 | 2023-09-14 | — | — | WO | claimed |
| CN-115593057-A | Three-layer co-extrusion biodegradable preservative film and preparation method thereof | 广东省科学院生物与医学工程研究所（CN） | 2023-01-13 | — | — | CN | claimed |
| CN-114672028-A | Ultraviolet-curing epoxy-modified organic silicon release agent and preparation method thereof | 山东灵晓新材料有限公司 | 2022-06-28 | — | — | CN | claimed |
| CN-113845775-B | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2022-06-21 | — | — | CN | claimed |
| CN-114292615-B | Composition, adhesive film and chip packaging structure | 武汉市三选科技有限公司 | 2022-06-03 | — | — | CN | claimed |
| CN-114292615-A | Composition, adhesive film and chip packaging structure | 武汉市三选科技有限公司 | 2022-04-08 | — | — | CN | claimed |
| CN-120137142-A | Intrinsic flame-retardant/antibacterial organic phosphine modified unsaturated resin and preparation method thereof | 浙江工业大学 | 2025-06-13 | — | — | CN | disclosed |
| CN-120091500-A | Method for manufacturing copper substrate | 健鼎（无锡）电子有限公司 | 2025-06-03 | — | — | CN | disclosed |
| CN-119708491-A | Polydisulfide polymer material containing hydroxy ester group and preparation method thereof | 衢州化工新材料创新研究院 | 2025-03-28 | — | — | CN | disclosed |
| CN-117826527-A | High refractive index resin composition for lithography, preparation method thereof and device | 武汉尚赛光电科技有限公司 | 2024-04-05 | — | — | CN | disclosed |
| WO-2023168833-A1 | COMPOSITION, ADHESIVE FILM AND CHIP PACKAGING STRUCTURE | 武汉市三选科技有限公司 | 2023-09-14 | — | — | WO | disclosed |
| CN-116425955-A | Epoxy thermosetting system material based on nylon 6 byproducts and preparation method thereof | 浙江工业大学 | 2023-07-14 | — | — | CN | disclosed |
| CN-115926379-A | Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof | 江南大学 | 2023-04-07 | — | — | CN | disclosed |
| CN-115593057-A | Three-layer co-extrusion biodegradable preservative film and preparation method thereof | 广东省科学院生物与医学工程研究所（CN） | 2023-01-13 | — | — | CN | disclosed |
| CN-114672028-A | Ultraviolet-curing epoxy-modified organic silicon release agent and preparation method thereof | 山东灵晓新材料有限公司 | 2022-06-28 | — | — | CN | disclosed |
| CN-113845775-B | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2022-06-21 | — | — | CN | disclosed |
| CN-114292615-B | Composition, adhesive film and chip packaging structure | 武汉市三选科技有限公司 | 2022-06-03 | — | — | CN | disclosed |
| CN-114292615-A | Composition, adhesive film and chip packaging structure | 武汉市三选科技有限公司 | 2022-04-08 | — | — | CN | disclosed |