SCHEMBL2950184

SCHEMBL2950184

CCCCC(CC)c1nc2ccccc2[nH]1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.59
IDO1 P14902 1/20 0.50
POLB P06746 1/20 0.50
TAAR1 Q96RJ0 1/20 0.49
BCHE P06276 1/20 0.49
TRPC3 Q13507 1/20 0.49
TRPC4 Q9UBN4 1/20 0.49
TRPC5 Q9UL62 1/20 0.49
NPC1 O15118 1/20 0.49
RAB9A P51151 1/20 0.49
KMT2A Q03164 3/20 0.48
CYP2D6 P10635 2/20 0.48
CYP2C9 P11712 2/20 0.48
CYP2C19 P33261 2/20 0.48
MEN1 O00255 2/20 0.48
TP53 P04637 2/20 0.48
CYP3A4 P08684 2/20 0.48
MAPK1 P28482 2/20 0.48
MAPT P10636 2/20 0.47
LMNA P02545 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30872632 0.94 ALDH1A1 (0.53) ALDH1A1IDO1POLBTAAR1BCHE
SCHEMBL30872649 0.94 ALDH1A1 (0.53) ALDH1A1IDO1POLBTAAR1BCHE
SCHEMBL24276044 0.91 ALDH1A1 (0.59) ALDH1A1IDO1POLBTAAR1BCHE
SCHEMBL11414051 0.91 ALDH1A1 (0.53) ALDH1A1IDO1POLBTAAR1KMT2A
SCHEMBL9224380 0.90 ALDH1A1 (0.57) ALDH1A1IDO1POLBTAAR1BCHE
SCHEMBL7854778 0.88 ALDH1A1 (0.55) ALDH1A1IDO1POLBTAAR1BCHE
SCHEMBL30583063 0.87 ALDH1A1 (0.59) ALDH1A1IDO1POLBTAAR1KMT2A
SCHEMBL3161814 0.87 ALDH1A1 (0.59) ALDH1A1IDO1POLBTAAR1KMT2A
SCHEMBL19132556 0.85 ALDH1A1 (0.53) ALDH1A1IDO1POLBTAAR1BCHE
SCHEMBL27682492 0.84 ALDH1A1 (0.61) ALDH1A1IDO1POLBTAAR1BCHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 278 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-5093281-A None JP disclosed
US-20260108989-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2026-04-23 US disclosed
US-12605794-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2026-04-21 US disclosed
US-12605783-B2 Method for manufacturing soldered products DENSO CORPORATION (JP) 2026-04-21 US disclosed
EP-4706873-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd. (JP) 2026-03-11 EP disclosed
CN-119730985-B Soldering flux and method for producing bonded body 千住金属工业株式会社 2026-02-27 CN disclosed
US-12544862-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2026-02-10 US disclosed
EP-4122640-B1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2026-01-07 EP disclosed
US-12515282-B2 Flux and method for producing electronic component SENJU METAL INDUSTRY CO., LTD. (JP) 2026-01-06 US disclosed
US-12502735-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2025-12-23 US disclosed
EP-1886759-A1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2008-02-13 EP disclosed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
US-20020067486-A1 Solderability assessment AMERICAN COMPETITIVENESS INSTITUTE 2002-06-06 US disclosed
JP-2001329378-A WATER SOLUBLE PREFLUX, PRINTED CIRCUIT BOARD AND SURFACE TREATING METHOD FOR METAL OF PRINTED CIRCUIT BOARD TAMURA KAKEN CO LTD 2001-11-27 JP disclosed
EP-0791671-B1 Surface treating agent for copper or copper alloy SHIKOKU CHEM (JP) 1999-06-16 EP disclosed
US-5795409-A MIXTURE OF A (BENZ)IMIDAZOLE COMPOUND, CHELATE COMPOUND AND IRON SHIKOKU CHEMICALS CORPORATION (JP) 1998-08-18 US disclosed
EP-0791671-A1 Surface treating agent for copper or copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1997-08-27 EP disclosed
US-5348590-A Surface treating agent for copper or copper alloys HITACHI, LTD. (JP) 1994-09-20 US disclosed
JP-H0593281-A SURFACE TREATMENT OF METAL YAMAGUCHI HIDEAKI 1993-04-16 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260108989-A1 FLUX AND SOLDER PASTE GRIN1, ROS1, PRXL2A ALDH1A1 1542/4885IDO1 3091/4885POLB 2181/4885
US-12544862-B2 Flux and solder paste PRXL2A, PTK2, SLC25A11 ALDH1A1 265/4885IDO1 3910/4885POLB 2057/4885
US-12605783-B2 Method for manufacturing soldered products ROS1, TFRC, MARK2 ALDH1A1 3515/4885IDO1 4814/4885POLB 3300/4885
US-12605794-B2 Flux and solder paste RIOK2, TRA2B, BAG2 ALDH1A1 1343/4885IDO1 4871/4885POLB 644/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.