SCHEMBL29506752

SCHEMBL29506752

CCCCCCNN=Nc1ccccc1.[Pt]

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 4/20 0.42
SIGMAR1 Q99720 1/20 0.42
EGFR P00533 1/20 0.41
EPHX1 P07099 3/20 0.41
ALDH1A1 P00352 2/20 0.41
HTT P42858 1/20 0.41
CYP1A1 P04798 1/20 0.40
TSHR P16473 1/20 0.40
CYP1B1 Q16678 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
KCNH3 Q9ULD8 1/20 0.37
HPGD P15428 1/20 0.36
RECQL P46063 1/20 0.36
ZDHHC2 Q9UIJ5 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28454510 1.00 NAAA (0.42) NAAASIGMAR1EGFREPHX1ALDH1A1
SCHEMBL10428049 0.98 NAAA (0.44) NAAASIGMAR1EGFREPHX1ALDH1A1
SCHEMBL8958323 0.98 NAAA (0.44) NAAASIGMAR1EGFREPHX1ALDH1A1
SCHEMBL8958331 0.98 NAAA (0.44) NAAASIGMAR1EGFREPHX1ALDH1A1
SCHEMBL10428051 0.98 NAAA (0.44) NAAASIGMAR1EGFREPHX1ALDH1A1
SCHEMBL29775536 0.97 NAAA (0.42) NAAASIGMAR1EGFREPHX1ALDH1A1
SCHEMBL9738358 0.80 NAAA (0.46) NAAASIGMAR1EGFREPHX1ALDH1A1
SCHEMBL9193383 0.80 CYP3A4 (0.48) SIGMAR1EGFRALDH1A1HPGD
SCHEMBL9193386 0.80 CYP3A4 (0.48) SIGMAR1EGFRALDH1A1HPGD
Azobenzene SCHEMBL27937521 0.79 ALDH1A1 (0.60) NAAAALDH1A1HTTTSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119799202-A High-toughness damp-heat-resistant ultraviolet light and heat dual-curing organic silica gel adhesive and preparation method thereof 苏州合邦鑫材科技有限公司 2025-04-11 CN claimed
CN-119799202-A High-toughness damp-heat-resistant ultraviolet light and heat dual-curing organic silica gel adhesive and preparation method thereof 苏州合邦鑫材科技有限公司 2025-04-11 CN disclosed
CN-118406465-A Single-component organic silicon sealant with low water vapor transmittance and high bonding strength, and preparation method and application thereof 韦尔通科技股份有限公司 2024-07-30 CN disclosed
CN-114335591-A Low-hardness heat-cured polyisobutylene sealant for hydrogen fuel cell 郝建强 2022-04-12 CN disclosed