SCHEMBL29567433

SCHEMBL29567433

O=C(O)c1ccc(N2C(=O)C=CC2=O)cc1O

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PIM3 Q86V86 1/20 0.64
HIPK4 Q8NE63 1/20 0.64
SCN2A Q99250 1/20 0.64
ALDH1A1 P00352 5/20 0.57
KDM4E B2RXH2 3/20 0.57
HPGD P15428 3/20 0.57
POLB P06746 2/20 0.57
MAPK1 P28482 2/20 0.57
HSD17B10 Q99714 1/20 0.57
MYC P01106 2/20 0.56
DUSP3 P51452 2/20 0.56
KLKB1 P03952 1/20 0.56
CTSB P07858 1/20 0.56
ELANE P08246 1/20 0.56
MMP9 P14780 1/20 0.56
PTGS1 P23219 1/20 0.55
PTGS2 P35354 1/20 0.55
DDAH1 O94760 1/20 0.55
TYMS P04818 1/20 0.52
PKM P14618 2/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3050771 1.00 PIM3 (0.64) PIM3HIPK4SCN2AALDH1A1KDM4E
SCHEMBL11668068 0.86 PTGS2 (0.59) PIM3HIPK4SCN2AALDH1A1KDM4E
SCHEMBL11563858 0.85 PTGS1 (0.62) PIM3HIPK4SCN2AALDH1A1HPGD
SCHEMBL28343010 0.82 PTGS1 (0.55) PIM3HIPK4SCN2AALDH1A1HPGD
SCHEMBL18163750 0.81 MGLL (0.46) PIM3HIPK4SCN2AALDH1A1KDM4E
SCHEMBL24938794 0.81 PTGS1 (0.54) PIM3HIPK4SCN2AALDH1A1HPGD
SCHEMBL24938790 0.81 DDAH1 (0.58) PIM3HIPK4SCN2AALDH1A1HPGD
SCHEMBL24939855 0.81 NPSR1 (0.59) PIM3HIPK4SCN2AALDH1A1HPGD
SCHEMBL24939818 0.81 PTGS1 (0.54) PIM3HIPK4SCN2AALDH1A1HPGD
SCHEMBL24939840 0.79 PIM3 (0.69) PIM3HIPK4SCN2AALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12408914-B2 Systems and methods for customizing mechanical strength in stimuli-responsive bioabsorbable materials CILAG GMBH INTERNATIONAL (CH) 2025-09-09 US disclosed
EP-4321541-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-06 EP disclosed
CN-117529509-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2025-01-10 CN disclosed
US-20240423617-A1 SYSTEMS AND METHODS FOR CUSTOMIZING MECHANICAL STRENGTH IN STIMULI-RESPONSIVE BIOABSORBABLE MATERIALS CILAG GMBH INTERNATIONAL (CH) 2024-12-26 US disclosed
CN-119095899-A Bismaleimide compound, resin composition using the same, cured product of the same, and semiconductor device 日本化药株式会社 2024-12-06 CN disclosed
US-20240382613-A1 METHODS AND SYSTEMS FOR ULTRASOUND STIMULATED STRUCTURES AND DELIVERY OF THERAPEUTIC SPECIES THE PENN STATE RESEARCH FOUNDATION 2024-11-21 US disclosed
EP-4074740-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2024-11-20 EP disclosed
CN-117355545-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-10-18 CN disclosed
CN-114787120-B Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-08-09 CN disclosed
EP-4398985-A2 METHODS AND SYSTEMS FOR ULTRASOUND STIMULATED STRUCTURES AND DELIVERY OF THERAPEUTIC SPECIES The Penn State Research Foundation (US) 2024-07-17 EP disclosed
CN-116490598-A Detergent compositions with enhanced efficacy delivery of substances 株式会社LG生活健康 2023-07-25 CN disclosed
CN-113348079-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-06-02 CN disclosed
CN-115933312-A Colored photosensitive composition, cured product, and image display device 日本化药株式会社 2023-04-07 CN disclosed
WO-2023038937-A2 METHODS AND SYSTEMS FOR ULTRASOUND STIMULATED STRUCTURES AND DELIVERY OF THERAPEUTIC SPECIES THE PENN STATE RESEARCH FOUNDATION (US) 2023-03-16 WO disclosed
EP-4074740-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-10-19 EP disclosed
CN-115032863-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-09-09 CN disclosed
CN-113795522-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-08-12 CN disclosed
CN-114787276-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-07-22 CN disclosed
CN-113242996-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-07-12 CN disclosed
WO-2022069948-A1 HIGH TEMPERATURE BENZOXAZINE RESINS, METHODS, AND USES THEREOF KANEKA CORPORATION (JP) 2022-04-07 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240382613-A1 METHODS AND SYSTEMS FOR ULTRASOUND STIMULATED STRUCTURES AND DELIVERY OF THERAPEUTIC SPECIES PAICS, APEX1, ADM2 PIM3 772/4885HIPK4 2820/4885SCN2A 4884/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.