⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29533016 | 0.95 | — | — | |
| SCHEMBL26117646 | 0.82 | KDM1A (0.31) | — | |
| SCHEMBL11412903 | 0.80 | — | — | |
| SCHEMBL12972100 | 0.80 | — | — | |
| SCHEMBL20507029 | 0.73 | ADORA3 (0.33) | — | |
| SCHEMBL11195857 | 0.73 | LMNA (0.30) | — | |
| SCHEMBL22300720 | 0.68 | LIG1 (0.37) | — | |
| SCHEMBL22300885 | 0.67 | ALOX5AP (0.33) | — | |
| SCHEMBL30106108 | 0.65 | HSD11B1 (0.31) | — | |
| SCHEMBL13645224 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117241942-B | Laminate body | 东洋纺株式会社 | 2026-05-19 | — | — | CN | disclosed |
| CN-115551713-B | Laminate comprising transparent high heat resistant film | 东洋纺株式会社 | 2025-03-21 | — | — | CN | disclosed |
| CN-115697575-B | Resin film and method for producing same | 东洋纺株式会社 | 2025-01-14 | — | — | CN | disclosed |
| CN-119072395-A | Laminate body | 东洋纺株式会社 | 2024-12-03 | — | — | CN | disclosed |
| CN-119053431-A | Method for producing film | 东洋纺株式会社 | 2024-11-29 | — | — | CN | disclosed |
| CN-114384757-B | Black photosensitive resin composition, method for producing patterned cured product, and black matrix | 东京应化工业株式会社 | 2024-11-19 | — | — | CN | disclosed |
| CN-118749013-A | Resin composition, cured product, electronic component, and display device | 东丽株式会社 | 2024-10-08 | — | — | CN | disclosed |
| CN-118613525-A | Resin composition, resin composition film, cured film, and semiconductor device using same | 东丽株式会社 | 2024-09-06 | — | — | CN | disclosed |
| CN-118578738-A | Laminate body | 东洋纺株式会社 | 2024-09-03 | — | — | CN | disclosed |
| CN-118524933-A | Laminate body | 东洋纺株式会社 | 2024-08-20 | — | — | CN | disclosed |
| CN-107561860-B | Photosensitive resin composition and application thereof | 东京应化工业株式会社 | 2022-09-27 | — | — | CN | disclosed |
| CN-107817649-B | Photosensitive resin composition, polyamide resin and method for producing same, compound and method for producing same, cured film and method for producing same | 东京应化工业株式会社 | 2022-09-16 | — | — | CN | disclosed |
| CN-108121158-B | Photosensitive composition, cured film, light-emitting layer for light-emitting display element, and method for forming light-emitting layer | 东京应化工业株式会社 | 2022-07-22 | — | — | CN | disclosed |
| CN-110249004-B | Polyimide precursor composition | 东京应化工业株式会社 | 2022-07-19 | — | — | CN | disclosed |
| CN-114761875-A | Photosensitive composition, cured product, and method for producing cured product | 东京应化工业株式会社 | 2022-07-15 | — | — | CN | disclosed |
| CN-114746808-A | Photosensitive composition, cured product, and method for producing cured product | 东京应化工业株式会社 | 2022-07-12 | — | — | CN | disclosed |
| CN-114644858-A | Pigment dispersion liquid, coloring composition, and method for dispersing pigment | 东京应化工业株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-114644859-A | Coloring composition, colored film, and method for forming colored film | 东京应化工业株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-114450350-A | Resin composition, resin composition film, cured film, hollow structure using the same, and semiconductor device | 东丽株式会社 | 2022-05-06 | — | — | CN | disclosed |
| CN-108389512-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-04-15 | — | — | CN | disclosed |