SCHEMBL29583446

SCHEMBL29583446

OCc1cc2ccccc2cc1CO

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDE4A P27815 1/20 0.46
PDE4B Q07343 1/20 0.46
PDE4C Q08493 1/20 0.46
PDE4D Q08499 1/20 0.46
APOBEC3G Q9HC16 1/20 0.44
MEN1 O00255 1/20 0.44
KMT2A Q03164 1/20 0.44
CYP2A6 P11509 4/20 0.43
CYP1A2 P05177 1/20 0.42
TSHR P16473 2/20 0.41
CYP2D6 P10635 1/20 0.40
SLC6A2 P23975 1/20 0.40
SLC6A4 P31645 1/20 0.40
SLC6A3 Q01959 1/20 0.40
KCNH2 Q12809 1/20 0.40
ALOX12 P18054 1/20 0.39
TRPM4 Q8TD43 1/20 0.39
ALDH1A1 P00352 2/20 0.38
HSD17B10 Q99714 2/20 0.38
TDP1 Q9NUW8 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL430273 1.00 PDE4A (0.46) PDE4APDE4BPDE4CPDE4DAPOBEC3G
SCHEMBL901034 0.95 PDE4A (0.48) PDE4APDE4BPDE4CPDE4DAPOBEC3G
SCHEMBL3043085 0.95 PDE4A (0.48) PDE4APDE4BPDE4CPDE4DAPOBEC3G
SCHEMBL15033126 0.87 ALDH1A1 (0.41) PDE4APDE4BPDE4CPDE4DAPOBEC3G
SCHEMBL1773980 0.85 TRPM4 (0.48) APOBEC3GMEN1KMT2ACYP2A6CYP1A2
SCHEMBL29825149 0.85 TRPM4 (0.48) APOBEC3GMEN1KMT2ACYP2A6CYP1A2
SCHEMBL29768796 0.85 TRPM4 (0.48) APOBEC3GMEN1KMT2ACYP2A6CYP1A2
SCHEMBL1506631 0.83 CYP1A2 (0.39) PDE4APDE4BPDE4CPDE4DAPOBEC3G
SCHEMBL8313745 0.83 MEN1 (0.46) PDE4APDE4BPDE4CPDE4DAPOBEC3G
SCHEMBL647376 0.83 IDO1 (0.45) PDE4APDE4BPDE4CPDE4DAPOBEC3G

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122080368-A Photosensitive resin, preparation method thereof and photosensitive resin composition 2026-05-26 CN claimed
CN-117510756-A Anti-wicking agent, preparation method and application thereof, polyester industrial filament and anti-wicking treatment method thereof 海利得新材料研究(上海)有限公司 2024-02-06 CN claimed
CN-115808847-B Anti-reflection coating resin for photoresist bottom and preparation method and application thereof 苏州润邦半导体材料科技有限公司 2023-04-28 CN claimed
CN-115808847-A Anti-reflection coating resin at bottom of photoresist as well as preparation method and application thereof 苏州润邦半导体材料科技有限公司 2023-03-17 CN claimed
CN-122080368-A Photosensitive resin, preparation method thereof and photosensitive resin composition 2026-05-26 CN disclosed
US-20260085145-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE DAINIPPON INK & CHEMICALS (JP) 2026-03-26 US disclosed
EP-4628517-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE DIC Corporation (JP) 2025-10-08 EP disclosed
CN-118931147-A Polycarbonate resin composition 三菱工程塑料株式会社 2024-11-12 CN disclosed
CN-112399993-B Thermoplastic resin composition and molded article 三菱工程塑料株式会社 2024-03-12 CN disclosed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-115808847-B Anti-reflection coating resin for photoresist bottom and preparation method and application thereof 苏州润邦半导体材料科技有限公司 2023-04-28 CN disclosed
CN-112442264-B Polycarbonate resin composition and molded article thereof 三菱工程塑料株式会社 2023-04-11 CN disclosed
CN-115808847-A Anti-reflection coating resin at bottom of photoresist as well as preparation method and application thereof 苏州润邦半导体材料科技有限公司 2023-03-17 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
CN-111201281-B Polycarbonate resin composition 三菱工程塑料株式会社 2022-09-09 CN disclosed
CN-114599735-A Thermoplastic resin composition and molded article 三菱工程塑料株式会社 2022-06-07 CN disclosed
WO-2022114157-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND MACROMONOMER COPOLYMER 三菱ケミカル株式会社 2022-06-02 WO disclosed
CN-110753714-B Aromatic polycarbonate resin, process for producing the same, and aromatic dihydroxy compound 三菱化学株式会社 2022-04-29 CN disclosed
CN-110719936-B Polycarbonate resin composition for optical member and optical member 三菱工程塑料株式会社 2022-03-04 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260085145-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE MAT1A, CAPZA1, CDH1 PDE4A 4461/4885PDE4B 4494/4885PDE4C 4486/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.