SCHEMBL29620218

SCHEMBL29620218

CC(Cc1ccccc1)=NOC(=O)c1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 3/20 0.53
MAPT P10636 3/20 0.51
CDK5 Q00535 2/20 0.51
CDK5R1 Q15078 2/20 0.51
PKM P14618 2/20 0.51
NPC1 O15118 4/20 0.48
RAB9A P51151 4/20 0.48
KMT2A Q03164 2/20 0.47
SLC6A2 P23975 1/20 0.47
SLC6A3 Q01959 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
RBBP9 O75884 1/20 0.47
TNF P01375 1/20 0.47
KLF5 Q13887 1/20 0.47
NOD1 Q9Y239 1/20 0.47
L3MBTL1 Q9Y468 3/20 0.46
ALDH1A1 P00352 1/20 0.46
KDM4E B2RXH2 2/20 0.45
XDH P47989 2/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29501294 0.87 ALDH1A1 (0.46) SMN1; SMN2MAPTCDK5CDK5R1PKM
SCHEMBL14743769 0.84 KDM4E (0.49) SMN1; SMN2PKMKMT2ATDP1L3MBTL1
SCHEMBL19733326 0.84 KDM4E (0.49) SMN1; SMN2PKMKMT2ATDP1L3MBTL1
SCHEMBL18840215 0.84 KDM4E (0.49) SMN1; SMN2PKMKMT2ATDP1L3MBTL1
SCHEMBL30956918 0.83 SMN1; SMN2 (0.56) SMN1; SMN2MAPTCDK5CDK5R1PKM
SCHEMBL92008 0.78 SMN1; SMN2 (0.79) SMN1; SMN2MAPTCDK5CDK5R1PKM
SCHEMBL10779103 0.78 SMN1; SMN2 (0.62) SMN1; SMN2MAPTCDK5CDK5R1PKM
SCHEMBL12328529 0.78 SMN1; SMN2 (0.62) SMN1; SMN2MAPTCDK5CDK5R1PKM
Propiophenone SCHEMBL29274329 0.78 SMN1; SMN2 (0.50) SMN1; SMN2MAPTCDK5CDK5R1PKM
SCHEMBL29914240 0.78 ALDH1A1 (0.44) SMN1; SMN2KMT2AL3MBTL1ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
WO-2022089228-A1 CURABLE RESIN COMPOSITION AND SOLDER RESIST FILM FORMED THEREFROM, INTERLAYER INSULATING MATERIAL, AND PRINTED CIRCUIT BOARD 常州正洁智造科技有限公司 2022-05-05 WO disclosed