SCHEMBL29914240

SCHEMBL29914240

CCOC(=O)ON=C(C)Cc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.44
RECQL P46063 1/20 0.44
L3MBTL1 Q9Y468 4/20 0.43
KDM4E B2RXH2 2/20 0.43
MMP8 P22894 2/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
MAPK1 P28482 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.40
CES2 O00748 1/20 0.40
CES1 P23141 1/20 0.40
AKR1B1 P15121 1/20 0.40
PAM P19021 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14743769 0.82 KDM4E (0.49) ALDH1A1L3MBTL1KDM4EMEN1KMT2A
SCHEMBL19733326 0.82 KDM4E (0.49) ALDH1A1L3MBTL1KDM4EMEN1KMT2A
SCHEMBL18840215 0.82 KDM4E (0.49) ALDH1A1L3MBTL1KDM4EMEN1KMT2A
SCHEMBL31396 0.81 L3MBTL1 (0.41) ALDH1A1RECQLL3MBTL1MEN1KMT2A
SCHEMBL8205743 0.78 ALDH1A1 (0.54) ALDH1A1L3MBTL1KMT2AMAPK1
SCHEMBL29620218 0.78 SMN1; SMN2 (0.53) ALDH1A1L3MBTL1KDM4EKMT2ASMN1; SMN2
SCHEMBL29130148 0.77 TSHR (0.41) ALDH1A1MMP8MEN1KMT2A
SCHEMBL29130146 0.76 L3MBTL1 (0.46) L3MBTL1MEN1KMT2ASMN1; SMN2
SCHEMBL27836929 0.76 ALDH1A1 (0.49) ALDH1A1MEN1KMT2AMAPK1SMN1; SMN2
SCHEMBL195607 0.75 ALDH1A1 (0.50) ALDH1A1L3MBTL1KDM4EMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115725251-B Encapsulation material and electronic device module including the same 杭州福斯特应用材料股份有限公司 2024-12-31 CN disclosed
EP-4071182-A1 ALICYCLIC ACRYLATE COMPOUND, ALICYCLIC EPOXY ACRYLATE COMPOUND, CURABLE COMPOSITION, AND CURED ARTICLE ENEOS Corporation (JP) 2022-10-12 EP disclosed