Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 1.00 |
| ▸ | CA2 | P00918 | 5/20 | 0.71 |
| ▸ | CA1 | P00915 | 4/20 | 0.71 |
| ▸ | CA12 | O43570 | 3/20 | 0.71 |
| ▸ | CA9 | Q16790 | 3/20 | 0.71 |
| ▸ | CA4 | P22748 | 2/20 | 0.71 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.71 |
| ▸ | TSHR | P16473 | 2/20 | 0.68 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.68 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.68 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.68 |
| ▸ | F2 | P00734 | 3/20 | 0.57 |
| ▸ | PRSS1 | P07477 | 3/20 | 0.57 |
| ▸ | PRSS2 | P07478 | 3/20 | 0.57 |
| ▸ | PRSS3 | P35030 | 3/20 | 0.57 |
| ▸ | ANXA2 | P07355 | 1/20 | 0.55 |
| ▸ | S100A10 | P60903 | 1/20 | 0.55 |
| ▸ | POLB | P06746 | 1/20 | 0.55 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.52 |
| ▸ | CASP1 | P29466 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5561963 | 1.00 | LMNA (1.00) | LMNACA2CA1CA12CA9 | |
| SCHEMBL34546 | 1.00 | LMNA (1.00) | LMNACA2CA1CA12CA9 | |
| SCHEMBL30544199 | 1.00 | LMNA (1.00) | LMNACA2CA1CA12CA9 | |
| SCHEMBL324628 | 0.98 | LMNA (0.95) | LMNACA2CA1CA12CA9 | |
| Benzene SCHEMBL27752989 | 0.98 | LMNA (0.95) | LMNACA2CA1CA12CA9 | |
| SCHEMBL1100221 | 0.95 | LMNA (0.91) | LMNACA2CA1CA12CA9 | |
| SCHEMBL487472 | 0.93 | LMNA (0.87) | LMNACA2CA1CA12CA9 | |
| SCHEMBL29692583 | 0.91 | LMNA (0.83) | LMNACA2CA1CA12CA9 | |
| SCHEMBL34500 | 0.91 | LMNA (0.83) | LMNACA2CA1CA12CA9 | |
| SCHEMBL8721954 | 0.91 | LMNA (0.83) | LMNACA2CA1CA12CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025058250-A1 | HEAT-SEALABLE POLYIMIDE ADHESIVE FILM AND METHOD FOR MANUFACTURING SAME | (주)아이피아이테크 | 2025-03-20 | — | — | WO | claimed |
| WO-2022114938-A1 | POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR | 피아이첨단소재 주식회사 | 2022-06-02 | — | — | WO | claimed |
| WO-2025058250-A1 | HEAT-SEALABLE POLYIMIDE ADHESIVE FILM AND METHOD FOR MANUFACTURING SAME | (주)아이피아이테크 | 2025-03-20 | — | — | WO | disclosed |
| CN-119192778-A | Epoxy resin composition, preparation method thereof and composite material | 中复神鹰(上海)科技有限公司 | 2024-12-27 | — | — | CN | disclosed |
| WO-2024101868-A1 | BINDER COMPRISING POLYAMIDE POLYMER, POSITIVE ELECTRODE FOR SECONDARY BATTERY COMPRISING BINDER, AND SECONDARY BATTERY COMPRISING POSITIVE ELECTRODE | 주식회사 한솔케미칼 | 2024-05-16 | — | — | WO | disclosed |
| WO-2024091011-A1 | BINDER COMPRISING POLYAMIDE POLYMER, POSITIVE ELECTRODE FOR SECONDARY BATTERY COMPRISING BINDER, AND SECONDARY BATTERY COMPRISING POSITIVE ELECTRODE | 주식회사 한솔케미칼 | 2024-05-02 | — | — | WO | disclosed |
| US-20240059943-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR PRE-CURING PROCESSES WITHOUT ADDITIONAL METAL JOINING TECHNIQUES | SIKA TECHNOLOGY AG (CH) | 2024-02-22 | — | — | US | disclosed |
| WO-2024010418-A1 | POLYIMIDE FILM FOR GRAPHITE SHEET, AND GRAPHITE SHEET PREPARED THEREFROM | 피아이첨단소재 주식회사 | 2024-01-11 | — | — | WO | disclosed |
| EP-4303250-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-01-10 | — | — | EP | disclosed |
| WO-2022210415-A1 | MULTILAYER BODY, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT COMPRISING SAID CURED PRODUCT | 太陽インキ製造株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022203327-A1 | POLYIMIDE FILM FOR GRAPHITE SHEET AND GRAPHITE SHEET PREPARED THEREFROM | 피아이첨단소재 주식회사 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022181764-A1 | MULTILAYER STRUCTURE AND FLEXIBLE PRINTED WIRING BOARD | 太陽インキ製造株式会社 | 2022-09-01 | — | — | WO | disclosed |
| EP-4026867-A1 | POLYAMIDE IMIDE RESIN, RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | Showa Denko Materials Co., Ltd. (JP) | 2022-07-13 | — | — | EP | disclosed |
| WO-2022114938-A1 | POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR | 피아이첨단소재 주식회사 | 2022-06-02 | — | — | WO | disclosed |
| CN-110799559-B | Resin, resin composition, nonwoven fabric, fiber product, separator, secondary battery, electric double layer capacitor, and method for producing nonwoven fabric | 东丽株式会社 | 2022-04-29 | — | — | CN | disclosed |