SCHEMBL324628

SCHEMBL324628

Nc1cccc(S(=O)(=O)c2cccc(S(=O)(=O)c3cccc(N)c3)c2)c1

nearest known ligand 0.95

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.95
CA2 P00918 5/20 0.68
CA1 P00915 4/20 0.68
CA12 O43570 3/20 0.68
CA9 Q16790 3/20 0.68
CA4 P22748 2/20 0.68
CA14 Q9ULX7 1/20 0.68
TSHR P16473 3/20 0.65
ALDH1A1 P00352 3/20 0.65
HSD17B10 Q99714 1/20 0.65
TDP1 Q9NUW8 1/20 0.65
F2 P00734 3/20 0.55
PRSS1 P07477 3/20 0.55
PRSS2 P07478 3/20 0.55
PRSS3 P35030 3/20 0.55
ANXA2 P07355 1/20 0.53
S100A10 P60903 1/20 0.53
POLB P06746 1/20 0.53
CYP3A4 P08684 2/20 0.50
CYP19A1 P11511 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5561963 0.98 LMNA (1.00) LMNACA2CA1CA12CA9
SCHEMBL34546 0.98 LMNA (1.00) LMNACA2CA1CA12CA9
SCHEMBL29635012 0.98 LMNA (1.00) LMNACA2CA1CA12CA9
SCHEMBL30544199 0.98 LMNA (1.00) LMNACA2CA1CA12CA9
Benzene SCHEMBL27752989 0.95 LMNA (0.95) LMNACA2CA1CA12CA9
SCHEMBL1100221 0.93 LMNA (0.91) LMNACA2CA1CA12CA9
SCHEMBL487472 0.91 LMNA (0.87) LMNACA2CA1CA12CA9
SCHEMBL34500 0.89 LMNA (0.83) LMNACA2CA1CA12CA9
SCHEMBL8721954 0.89 LMNA (0.83) LMNACA2CA1CA12CA9
SCHEMBL29692583 0.89 LMNA (0.83) LMNACA2CA1CA12CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 199 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240218126-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2024-07-04 US claimed
EP-4393981-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI Advanced Materials Co., Ltd. (KR) 2024-07-03 EP claimed
WO-2024117669-A1 POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-06-06 WO claimed
WO-2024112104-A1 POLYIMIDE FILM COMPRISING ADDITIVE AND GRAPHITE SHEET PREPARED BY USING SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-05-30 WO claimed
WO-2024101868-A1 BINDER COMPRISING POLYAMIDE POLYMER, POSITIVE ELECTRODE FOR SECONDARY BATTERY COMPRISING BINDER, AND SECONDARY BATTERY COMPRISING POSITIVE ELECTRODE 주식회사 한솔케미칼 2024-05-16 WO claimed
WO-2024091011-A1 BINDER COMPRISING POLYAMIDE POLYMER, POSITIVE ELECTRODE FOR SECONDARY BATTERY COMPRISING BINDER, AND SECONDARY BATTERY COMPRISING POSITIVE ELECTRODE 주식회사 한솔케미칼 2024-05-02 WO claimed
WO-2024076094-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2024-04-11 WO claimed
US-20240026098-A1 POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR PI ADVANCED MATERIALS CO., LTD. (KR) 2024-01-25 US claimed
WO-2023243967-A1 BLACK POLYIMIDE FILM AND MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2023-12-21 WO claimed
WO-2023200191-A1 MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2023-10-19 WO claimed
WO-2023191434-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR 피아이첨단소재 주식회사 2023-10-05 WO claimed
US-20230002613-A1 LOW-DIELECTRIC-CONSTANT POLYIMIDE COMPOSITE POWDER, AND METHOD FOR PRODUCING SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2023-01-05 US claimed
US-12107297-B2 Composition for coating layer including heat-resistant binder, hydroxy-containing polyimide particle, and silane crosslinker, separator for rechargeable lithium battery including coating layer formed therefrom and rechargeable lithium battery including the same SAMSUNG SDI CO., LTD. (KR) 2024-10-01 US disclosed
US-20240228792-A1 BLACK VARNISH AND FILM CONTAINING SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-07-11 US disclosed
US-20240218126-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2024-07-04 US disclosed
EP-4393981-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI Advanced Materials Co., Ltd. (KR) 2024-07-03 EP disclosed
US-6159654-A Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating KABUSHIKI KAISHA TOSHIBA (JP) 2000-12-12 US disclosed
US-6001517-A A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT KABUSHIKI KAISHA TOSHIBA (JP) 1999-12-14 US disclosed
US-5756650-A COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 US disclosed
US-5578697-A DIELECTRIC POLYMERS FOR ELECTRONICS KABUSHIKI KAISHA TOSHIBA (JP) 1996-11-26 US disclosed